Patterning of parallel nanobridge structures by reverse nanostencil lithography using an edge-patterned stencil

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The present invention concerns a bodily implantable or probe device and microelectrode fabrication method comprising providing at least one silicon substrate including an electronic device or unit; providing, on a first side of the silicon substrate, at le ...

Inductive magnetic sensors are needed for tokamak operation to provide the low-frequency (LF) measurements leading to the equilibrium reconstruction and to monitor the higher frequency (HF) instabilities; the HF magnetic sensors are often also used as a ba ...

This work extends the range of pathways for the production of metallic microcomponents by downscaling metal casting. This is accomplished by using either of two different molding techniques, namely femtosecond laser micromachining or lithographic silicon m ...

Photonic integrated circuits have the potential to pervade into multiple applications traditionally limited to bulk optics. Of particular interest for new applications are ferroelectrics such as Lithium Niobate, which exhibit a large Pockels effect, but ar ...

A controlled manipulation of graphene edges and vacancies is desired for molecular separation, sensing and electronics applications. Unfortunately, available etching methods always lead to vacancy nucleation making it challenging to control etching. Herein ...

We present the concept and detailed design of a Smart Slit Assembly for next generation spectrometers, and we experimentally demonstrate operation of an individual 221 mu m x 111 mu m smart slit channel employing a MEMS actuated shutter to continuously mod ...

Dielectric breakdown etching is a well-known method of making nanopores on thin (similar to 50 nm) dielectric membranes. However, voltage driven translocation of biomolecules through such nanopores becomes extremely fast. For improved detection, for instan ...

The most prevalent materials used in the field of plasmonics are Au and Ag. However, for the past few years, the plasmonic community has also been looking for alternative materials that have lower losses than Au and higher stability than Ag. This thesis is ...

We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturin ...

Etching an ensemble of vacancy defects (nanopores) in single-layer graphene (SLG) to obtain a high density of nanopores with an effective size that enables high-performance gas sieving is challenging. This is because nanopore nucleation and expansion are u ...

A method for manufacturing vias in a silicon wafer, the silicon wafer having a crystal orientation, and having a plane that is perpendicular to a surface of the wafer, tilted by 35.26°, the method comprising the steps of providing a mask having ...

We present the concept and design, and we report on the experimental performance of a broadband Variable Optical Attenuator (VOA) for integration with large-core rectangular multimode waveguides. Operation of an individual 221 mu m x 111 mu m optical waveg ...

Silicon nanowire-based sensors find many applications in micro- and nano-electromechanical systems, thanks to their unique characteristics of flexibility and strength that emerge at the nanoscale. This work is the first study of this class of micro- and na ...

We report on the design, fabrication and optical performance of gain mirrors in single crystal diamond substrates for vertical external cavity surface emitting lasers (VECSELs). VECSELs have gained attention recently due to their potential for high emissio ...

Atomically thin (2D) nanoporous membranes are an excellent platform for a broad scope of academic research. Their thickness and intrinsic ion selectivity (demonstrated for example in molybdenum disulfide-MoS2) make them particularly attractive for single-m ...

In proximity mask aligner photolithography, diffraction of light at the mask pattern is the predominant source for image shape distortions such as line end shortening and corner rounding. One established method to mitigate the impact of diffraction is opti ...

The thermal boundary conductance (TBC) of metal/dielectric couples was measured for a large variety of metals on silicon, sapphire, and diamond using time domain thermoreflectance and compared to data previously obtained on diamond. In the case of silicon, ...

A high-power LED-based illumination system has been developed as a replacement for the mercury arc lamps used in mask-aligner lithography. LEDs are arranged in a grid array and placed in the entrance aperture of individual reflectors. Those reflectors decr ...

Silicon heterojunction (SHJ) solar cells have reached record efficiency, particularly in all-back-contacted architectures. Despite this, two-side contacted SHJ cells still suffer from parasitic absorption and series resistance losses in the amorphous silic ...

Patterning of parallel nanobridge structures by reverse nanostencil lithography using an edge-patterned stencil

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Smart Slit Assembly Employing Continuously Tunable MEMS Shutter

Optimized electrochemical breakdown etching using temporal voltage variation for formation of nanopores in a silicon membrane

Fabrication and applications of AuAg alloy metasurfaces and hybrid metal dielectric nanoantennas

The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias

Systematic design of millisecond gasification reactor for the incorporation of gas-sieving nanopores in single-layer graphene

System and method for removing scalloping and tapering effects in high aspect ratio through-silicon vias of wafers

Mems Shutter Based Variable Optical Attenuator Integrated With Large Core Multimode Rectangular Waveguides

Real- and Q-space travelling: multi-dimensional distribution maps of crystal-lattice strain (epsilon(044)) and tilt of suspended monolithic silicon nanowire structures

Single crystal diamond gain mirrors for high performance vertical external cavity surface emitting lasers

Wafer-Scale Fabrication of Nanopore Devices for Single-Molecule DNA Biosensing using MoS2

Computational rule-based approach for corner correction of non-Manhattan geometries in mask aligner photolithography

Towards a coherent database of thermal boundary conductance at metal/dielectric interfaces

Spatial coherence properties of an LED-based illumination system for mask-aligner lithography

Low Temperature p-type Microcrystalline Silicon as Carrier Selective Contact for Silicon Heterojunction Solar Cells