Publications by Yüksel Temiz | EPFL Graph Search

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Recent advances in bio-sensing technologies have led to design of bio-sensor arrays for rapid identification and quantification of various biological agents such as drugs, gene expressions, proteins, cholesterol, fats, etc. Various dedicated sensing arrays ...

This paper presents a switched-capacitor (SC) current integrator circuit for impedance measurement of tethered bilayer lipid membrane (tBLM) biosensors. The circuit comprises a small number of high performance components enabling enhanced experimental flex ...

This paper presents an experimental study on different microelectrode fabrication techniques, with particular focus on the robustness of the surface insulation towards typical working conditions required in lab-on-a-chip applications. Pt microelectrodes wi ...

An innovative modular 3-D stacked multi-processor architecture is presented. The platform is composed of completely identical stacked dies connected together by through-silicon-vias (TSVs). Each die features four 32-bit embedded processors and associated m ...

This paper presents a chip-level postcomplementary metal oxide semiconductor (CMOS) processing technique for 3-D integration and through-silicon-via (TSV) fabrication. The proposed technique is based on dry-film lithography, which is a low-cost and simple ...

Three Dimensional (3D) integration, based on through silicon vias (TSV), has the potential to become a key enabling technology for many applications. TSVs are commonly categorized according to their aspect ratio and diameter. An equally important parameter ...

In this paper, a CMOS-compatible chip-to-chip 3D integration platform will be presented. The developed technology allows reconstituting a wafer from diced and thinned chips. Then, chip-to-chip bonding and TSV fabrication steps are accomplished in wafer-lev ...

In this letter we report on the fabrication and characterization of titanium dioxide (TiO2)-based resistive RAM (ReRAM) co-integration with 380 ìm-height Cu Through Silicon Via (TSV) arrays for programmable 3D interconnects. Nonvolatile resistive switching ...

This paper presents a novel sensor front-end circuit that addresses the issues of 1/f noise and distortion in a unique way by using canceling techniques. The proposed front-end is a fully differential transimpedance amplifier (TIA) targeted for current mod ...

This paper reports a new post-CMOS processing platform for die-level through-silicon-via (TSV) fabrication, based on wafer reconstitution from embedded dies, parylene deposition, stencil lithography, and bottom-up electroplating. The goal of this work is t ...

This paper reports a micro electro-mechanical system (MEMS) based sensor array integrated with CMOS-based optical readout. The integrated architecture has several unique features. MEMS devices are passive and there are no electrical connections to the MEMS ...

The paper discusses the recent achievements in the development of chips with integrated sensing of biomolecules. In particular, it focuses on integrated sensing electrodes on silicon and presents innovative solutions for the enhanced robustness of the elec ...

A method for performing a post processing pattern on a diced chip having a foot-print, comprises the steps of providing a support wafer; applying a first dry film photoresist to the support wafer; positioning a mask corresponding to the footprint of the di ...

A review is presented of advances and challenges in fully integrated systems for personalised medicine applications. One key issue for the commercialisation of such systems is the disposability of the assay-substrate at a low cost. This work adds a new dim ...

Yüksel Temiz

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3D Architecture and Replaceable Layers for Label-Free DNA Biochips

Real-time high-sensitivity impedance measurement interface for tethered BLM biosensor arrays

A Comparative Study on Fabrication Techniques for On-Chip Microelectrodes

Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology

Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography

Fabrication and characterization of wafer-level deep TSV arrays

A CMOS Compatible Chip-to-Chip 3D Integration Platform

Resistive Programmable Through Silicon Vias for Reconfigurable 3D Fabrics

A 0.18 mu m Biosensor Front-End Based on 1/f Noise, Distortion Cancelation and Chopper Stabilization Techniques

Die-Level TSV Fabrication Platform for CMOS-MEMS Integration

Design and characterization of micromachined sensor array integrated with CMOS based optical readout

Integrating Bio-sensing Functions on CMOS Chips

Post-cmos processing and 3d integration based on dry-film lithography

3D Integration Technology for Lab-on-a-Chip Applications