Home

Person

Michail Zervas

This person has left EPFL

About
Privacy
Disclaimer

Graph Chatbot

Related publications (30)

Page 1 of 2

Vertically-stacked gate-all-around polysilicon nanowire FETs with sub-μm gates patterned by nanostencil lithography

Giovanni De Micheli, Yusuf Leblebici, Jürgen Brugger, Andreea Veronica Savu, Davide Sacchetto, Michail Zervas, Shenqi Xie

We report on the top-down fabrication of vertically-stacked polysilicon nanowire (NW) gate-all-around (GAA) field-effect-transistors (FET) by means of Inductively Coupled Plasma (ICP) etching and nanostencil lithography. The nanostencil is used to form sub ...

Elsevier2012

Monolithic Integration of Silicon Nanowires With a Microgripper

Yusuf Leblebici, Michail Zervas

Si nanowire (NW) stacks are fabricated by utilizing the scalloping effect of inductively coupled plasma deep reactive ion etching. When two etch windows are brought close enough, scallops from both sides will ideally meet along the dividing centerline of t ...

Institute of Electrical and Electronics Engineers2009

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Yusuf Leblebici, John Richard Thome, Michail Zervas, Yassir Madhour

Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...

IEEE2013

Raman Self-Frequency Shift of Dissipative Kerr Solitons in an Optical Microresonator

Tobias Kippenberg, Maxim Karpov, Martin Hubert Peter Pfeiffer, Hairun Guo, Arne Kordts, Victor Brasch, Michail Zervas, Michael Wolfgang Geiselmann

The formation of temporal dissipative Kerr solitons in microresonators driven by a continuous-wave laser enables the generation of coherent, broadband, and spectrally smooth optical frequency combs as well as femtosecond pulse sources with compact form fac ...

American Physical Society2016

Octave-spanning dissipative Kerr soliton frequency combs in Si3N4 microresonators

Tobias Kippenberg, Junqiu Liu, Maxim Karpov, Martin Hubert Peter Pfeiffer, Hairun Guo, Erwan Guillaume Albert Lucas, Michail Zervas

Octave-spanning, self-referenced frequency combs are applied in diverse fields ranging from precision metrology to astrophysical spectrometer calibration. The octave-spanning optical bandwidth is typically generated through non-linear spectral broadening o ...

Optical Soc Amer2017

Towards integrated photonic interposers for processing octave-spanning microresonator frequency combs

Davide Sacchetto, Michail Zervas, Michael Wolfgang Geiselmann

Microcombs-optical frequency combs generated in microresonators-have advanced tremendously in the past decade, and are advantageous for applications in frequency metrology, navigation, spectroscopy, telecommunications, and microwave photonics. Crucially, m ...

SPRINGERNATURE2021

Ultralow-power chip-based soliton microcombs for photonic integration

Tobias Kippenberg, Junqiu Liu, Maxim Karpov, Martin Hubert Peter Pfeiffer, Hairun Guo, Arslan Sajid Raja, Michail Zervas, Nils Johan Engelsen, Bahareh Ghadiani

The generation of dissipative Kerr solitons in optical microresonators has provided a route to compact frequency combs of high repetition rate, which have already been employed for optical frequency synthesizers, ultrafast ranging, coherent telecommunicati ...

OPTICAL SOC AMER2018

Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology

Yusuf Leblebici, Alessandro Cevrero, Michail Zervas, Yüksel Temiz, Giulia Beanato, Panagiotis Athanasopoulos, Paolo Giovannini

An innovative modular 3-D stacked multi-processor architecture is presented. The platform is composed of completely identical stacked dies connected together by through-silicon-vias (TSVs). Each die features four 32-bit embedded processors and associated m ...

2012

Ultralow-Power Photonic Chip-Based Soliton Frequency Combs

Tobias Kippenberg, Junqiu Liu, Maxim Karpov, Martin Hubert Peter Pfeiffer, Hairun Guo, Arslan Sajid Raja, Michail Zervas, Nils Johan Engelsen, Bahareh Ghadiani

The generation of dissipative Kerr solitons in optical microresonators allow compact high repetition rate frequency combs. A particularly promising platform is photonic integrated Si3N4 microresonators. Yet to date, soliton formation in Si3N4 microresonato ...

IEEE2018

On heat transfer at microscale with implications for microactuator design

Yusuf Leblebici, Michail Zervas

The dominance of conduction and the negligible effect of gravity, and hence free convection, are verified in the case of microscale heat sources surrounded by air at atmospheric pressure. A list of temperature-dependent heat transfer coefficients is provid ...

Institute of Physics2009

Highly efficient coupling of crystalline microresonators to integrated photonic waveguides

Tobias Kippenberg, Michail Zervas, Junqiu Liu, Miles Henry Anderson, John David Jost

Crystalline optical whispering gallery mode resonators made from alkaline earth fluorides can achieve exceptionally large optical finesse, and are used in a variety of applications, from frequency stabilization and narrow linewidth lasers, to low-noise mic ...

2018

Fabrication and characterization of wafer-level deep TSV arrays

Yusuf Leblebici, Michail Zervas, Yüksel Temiz

Three Dimensional (3D) integration, based on through silicon vias (TSV), has the potential to become a key enabling technology for many applications. TSVs are commonly categorized according to their aspect ratio and diameter. An equally important parameter ...

IEEE2012

A CMOS Compatible Chip-to-Chip 3D Integration Platform

Yusuf Leblebici, Carlotta Guiducci, Michail Zervas, Yüksel Temiz

In this paper, a CMOS-compatible chip-to-chip 3D integration platform will be presented. The developed technology allows reconstituting a wafer from diced and thinned chips. Then, chip-to-chip bonding and TSV fabrication steps are accomplished in wafer-lev ...

IEEE2012

Hybrid integrated photonics using bulk acoustic resonators

Tobias Kippenberg, Junqiu Liu, Michail Zervas

Integrated photonic devices based on Si3N4 waveguides allow for the exploitation of nonlinear frequency conversion, exhibit low propagation loss, and have led to advances in compact atomic clocks, ultrafast ranging, and spectroscopy. Yet, the lack of Pocke ...

Nature Research2020

Port: A Piezoelectric Optical Resonance Tuner

Tobias Kippenberg, Michail Zervas

This abstract presents an aluminum nitride (AlN) piezoelectric actuator for tuning optical resonance modes of silicon nitride photonic resonators. The AlN actuator is fabricated on top of a thick silicon dioxide cladding that encapsulates the nitride reson ...

IEEE2018

Resistive Programmable Through Silicon Vias for Reconfigurable 3D Fabrics

Giovanni De Micheli, Yusuf Leblebici, Davide Sacchetto, Michail Zervas, Yüksel Temiz

In this letter we report on the fabrication and characterization of titanium dioxide (TiO2)-based resistive RAM (ReRAM) co-integration with 380 ìm-height Cu Through Silicon Via (TSV) arrays for programmable 3D interconnects. Nonvolatile resistive switching ...

Institute of Electrical and Electronics Engineers2012

Ultralow-power chip-based soliton microcombs for photonic integration

Tobias Kippenberg, Junqiu Liu, Maxim Karpov, Martin Hubert Peter Pfeiffer, Hairun Guo, Arslan Sajid Raja, Michail Zervas, Anton Lukashchuk, Nils Johan Engelsen, Bahareh Ghadiani

Using the photonic Damascene reflow process, we present single soliton formation in 99-GHz-FSR Si3N4 microresonators of Q-factor exceeding 15 x 10(6), with less than 10 mW optical power. ...

IEEE2019

Up to 50 dB Extinction in Broadband Single-Stage Thermo-Optic Mach-Zehnder Interferometers for Programmable Low-Loss Silicon Nitride Photonic Circuits

Michail Zervas, Michael Wolfgang Geiselmann

We demonstrate single-stage thermo-optic Si3N4 interferometers with (46.1 +/- 2.5) dB average extinction ratio over 1460-1640 nm (approximate to 50x of typical devices). We analyze performance requirements for creating reconfigurable high-quality-factor re ...

IEEE2021

High throughput screening platform for ultra large scale integration based on high-k silicon nanowire ISFET and 3D integration

Michail Zervas

EPFL2013

Frequency comb generation in the green using silicon nitride microresonators

Tobias Kippenberg, Martin Hubert Peter Pfeiffer, Hairun Guo, Michail Zervas, Nicolas Volet

Optical frequency combs enable precision measurements in fundamental physics and have been applied to a growing number of applications, such as molecular spectroscopy, LIDAR and atmospheric trace-gas sensing. In recent years, the generation of frequency co ...

Wiley-VCH Verlag Berlin2016