Publications by Michail Zervas

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We report on the top-down fabrication of vertically-stacked polysilicon nanowire (NW) gate-all-around (GAA) field-effect-transistors (FET) by means of Inductively Coupled Plasma (ICP) etching and nanostencil lithography. The nanostencil is used to form sub ...

Si nanowire (NW) stacks are fabricated by utilizing the scalloping effect of inductively coupled plasma deep reactive ion etching. When two etch windows are brought close enough, scallops from both sides will ideally meet along the dividing centerline of t ...

Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...

The formation of temporal dissipative Kerr solitons in microresonators driven by a continuous-wave laser enables the generation of coherent, broadband, and spectrally smooth optical frequency combs as well as femtosecond pulse sources with compact form fac ...

Octave-spanning, self-referenced frequency combs are applied in diverse fields ranging from precision metrology to astrophysical spectrometer calibration. The octave-spanning optical bandwidth is typically generated through non-linear spectral broadening o ...

An ideal photonic integrated circuit for nonlinear photonic applications requires high optical nonlinearities and low loss. This work demonstrates a heterogeneous platform by bonding lithium niobate (LN) thin films onto a silicon nitride (Si3N4) waveguide ...

Microcombs-optical frequency combs generated in microresonators-have advanced tremendously in the past decade, and are advantageous for applications in frequency metrology, navigation, spectroscopy, telecommunications, and microwave photonics. Crucially, m ...

The generation of dissipative Kerr solitons in optical microresonators has provided a route to compact frequency combs of high repetition rate, which have already been employed for optical frequency synthesizers, ultrafast ranging, coherent telecommunicati ...

An innovative modular 3-D stacked multi-processor architecture is presented. The platform is composed of completely identical stacked dies connected together by through-silicon-vias (TSVs). Each die features four 32-bit embedded processors and associated m ...

The generation of dissipative Kerr solitons in optical microresonators allow compact high repetition rate frequency combs. A particularly promising platform is photonic integrated Si3N4 microresonators. Yet to date, soliton formation in Si3N4 microresonato ...

The dominance of conduction and the negligible effect of gravity, and hence free convection, are verified in the case of microscale heat sources surrounded by air at atmospheric pressure. A list of temperature-dependent heat transfer coefficients is provid ...

Three Dimensional (3D) integration, based on through silicon vias (TSV), has the potential to become a key enabling technology for many applications. TSVs are commonly categorized according to their aspect ratio and diameter. An equally important parameter ...

In this paper, a CMOS-compatible chip-to-chip 3D integration platform will be presented. The developed technology allows reconstituting a wafer from diced and thinned chips. Then, chip-to-chip bonding and TSV fabrication steps are accomplished in wafer-lev ...

Integrated photonic devices based on Si3N4 waveguides allow for the exploitation of nonlinear frequency conversion, exhibit low propagation loss, and have led to advances in compact atomic clocks, ultrafast ranging, and spectroscopy. Yet, the lack of Pocke ...

This abstract presents an aluminum nitride (AlN) piezoelectric actuator for tuning optical resonance modes of silicon nitride photonic resonators. The AlN actuator is fabricated on top of a thick silicon dioxide cladding that encapsulates the nitride reson ...

In this letter we report on the fabrication and characterization of titanium dioxide (TiO2)-based resistive RAM (ReRAM) co-integration with 380 ìm-height Cu Through Silicon Via (TSV) arrays for programmable 3D interconnects. Nonvolatile resistive switching ...

Using the photonic Damascene reflow process, we present single soliton formation in 99-GHz-FSR Si3N4 microresonators of Q-factor exceeding 15 x 10(6), with less than 10 mW optical power. ...

We demonstrate single-stage thermo-optic Si3N4 interferometers with (46.1 +/- 2.5) dB average extinction ratio over 1460-1640 nm (approximate to 50x of typical devices). We analyze performance requirements for creating reconfigurable high-quality-factor re ...

Optical frequency combs enable precision measurements in fundamental physics and have been applied to a growing number of applications, such as molecular spectroscopy, LIDAR and atmospheric trace-gas sensing. In recent years, the generation of frequency co ...

Michail Zervas

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Vertically-stacked gate-all-around polysilicon nanowire FETs with sub-μm gates patterned by nanostencil lithography

Monolithic Integration of Silicon Nanowires With a Microgripper

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Raman Self-Frequency Shift of Dissipative Kerr Solitons in an Optical Microresonator

Octave-spanning dissipative Kerr soliton frequency combs in Si3N4 microresonators

Heterogeneous integration of lithium niobate and silicon nitride waveguides for wafer-scale photonic integrated circuits on silicon

Towards integrated photonic interposers for processing octave-spanning microresonator frequency combs

Ultralow-power chip-based soliton microcombs for photonic integration

Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology

Ultralow-Power Photonic Chip-Based Soliton Frequency Combs

On heat transfer at microscale with implications for microactuator design

Fabrication and characterization of wafer-level deep TSV arrays

A CMOS Compatible Chip-to-Chip 3D Integration Platform

Hybrid integrated photonics using bulk acoustic resonators

Port: A Piezoelectric Optical Resonance Tuner

Resistive Programmable Through Silicon Vias for Reconfigurable 3D Fabrics

Ultralow-power chip-based soliton microcombs for photonic integration

Up to 50 dB Extinction in Broadband Single-Stage Thermo-Optic Mach-Zehnder Interferometers for Programmable Low-Loss Silicon Nitride Photonic Circuits

High throughput screening platform for ultra large scale integration based on high-k silicon nanowire ISFET and 3D integration

Frequency comb generation in the green using silicon nitride microresonators