Lecture

Packaging of Intelligent Systems

Graph Chat

Chat with Graph Search

Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.

DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.

In course

MICRO-301: Manufacturing technologies

This course gives an introduction to production methods and manufacturing technologies used in microengineering. The focus is given on the understanding of physical phenomena underlying the processes, the relation between materials, manufacturing processes ...

Description

This lecture covers the packaging of intelligent systems, focusing on solder systems like Sn-Ag-Cu, Pb-Free Solders, and solder deposition processes. It also discusses packaging trends, major chip interconnection types, and the evolution of packaging technologies over time.

Instructors (2)

Yves Bellouard

Dr. Yves Bellouard is Associate Professor in Microengineering at Ecole Polytechnique Fédérale de Lausanne (EPFL) in Switzerland, where he heads the Galatea lab and the Richemont Chair in micromanufacturing. He received a BS in Theoretical Physics and a MS in Applied Physics from Université Pierre et Marie Curie in Paris, France in 1994-1995 and a PhD in Microengineering from Ecole Polytechnique Fédérale de Lausanne (EPFL) in Lausanne, Switzerland in 2000. For his PhD work, he received the Omega Scientific prize (2001) for outstanding contribution in the field of microengineering for his work on Shape Memory Alloys. Before joining EPFL in 2015, he was Associate Professor at Eindhoven University of Technologies (TU/e) in the Netherlands and prior to that, Research Scientist at Rensselaer Polytechnic Institute (RPI) in Troy, New York for about four years where he started working on femtosecond laser processing of glass materials. From 2010 until 2013, Yves Bellouard initiated and coordinated the Femtoprint project, a European research initiative aiming at investigating a table-top printer for microsystems ('3D printing of microsystems'). In 2013, he received a prestigious ERC Starting Grant (Consolidator-2012) from the European Research Council and a JSPS Fellowship from the Japan Society for the Promotion of Science. His current research interests are on new paradigms for system integration at the microscale and in particular laser-based methods to tailor material properties for achieving higher level of integration in microsystems, like for instance integrating optics, mechanics and fluidics in a single monolith. These approaches open new opportunities for direct-write methods of microsystems (3D printing). Personal website

Vivek Subramanian

Teaching & PhD PhD Students Giovanni Ruffolo, Giada Romano, Sanjay Manoharan, Kyle Haas, Claude Dahan, Biruktait Ayele Lemecho, Yagmur Ceren Alatas, Tugçe Delipinar Past EPFL PhD Students Amin Hodaei, Mustafa Mohieldin Fadlelmula Fadlelseed Past EPFL PhD Students as codirector Mohammad Jafarpour Courses Organic and printed electronics MICRO-505 This course addresses the implementation of organic and printed electronics technologies using large area manufacturing techniques. It will provide

Official source

Ontological neighbourhood

Computer engineering

Hardware engineering: Microprocessors

Related concepts (32)

System in a package

A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when designing components for mobile phones, digital music players, etc.

Multi-chip module

A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".

Three-dimensional integrated circuit

A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.

Solder

Solder (UKˈsɒldə,_ˈsəʊldə; NA: ˈsɒdər) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.

Integrated circuit packaging

In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.

Related lectures (48)

Packaging of Intelligent Systems

Explores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.

Chip Packaging Process Flow: Major Steps

Covers the major steps in chip packaging and the evolution of packaging technologies.

Advanced MEMS Packaging

Explores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.

MEMS Packaging: 3D Integration & Advanced Technologies

Explores advanced MEMS packaging technologies, including 3D integration, hermetic packaging, and wafer-level packaging processes.

MEMS Packaging: Techniques and Considerations