Lecture

Packaging of Intelligent Systems

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In course

MICRO-301: Manufacturing technologies

This course gives an introduction to production methods and manufacturing technologies used in microengineering. The focus is given on the understanding of physical phenomena underlying the processes, the relation between materials, manufacturing processes ...

Description

This lecture covers the constraints impacting the packaging of systems with displays, batteries, microprocessors, and memory, as well as the hierarchical assembly of components in integrated systems. It also delves into the packaging of silicon integrated circuits, the hierarchy in microelectronics, and the chip packaging process flow. The discussion includes singulation technologies, advantages and disadvantages of cleaving, and the major steps in chip packaging such as dicing, wire bonding, and moulding. Furthermore, it explores the importance of solder in microelectronics, the classic Pb-Sn solder, and considerations for adding elements to tin. The lecture concludes with insights on Pb-free solders, their compositions, and concerns related to Cu dissolution, excessive IMCS, and voids.

Instructors (2)

Yves Bellouard

Dr. Yves Bellouard is Associate Professor in Microengineering at Ecole Polytechnique Fédérale de Lausanne (EPFL) in Switzerland, where he heads the Galatea lab and the Richemont Chair in micromanufacturing. He received a BS in Theoretical Physics and a MS in Applied Physics from Université Pierre et Marie Curie in Paris, France in 1994-1995 and a PhD in Microengineering from Ecole Polytechnique Fédérale de Lausanne (EPFL) in Lausanne, Switzerland in 2000. For his PhD work, he received the Omega Scientific prize (2001) for outstanding contribution in the field of microengineering for his work on Shape Memory Alloys. Before joining EPFL in 2015, he was Associate Professor at Eindhoven University of Technologies (TU/e) in the Netherlands and prior to that, Research Scientist at Rensselaer Polytechnic Institute (RPI) in Troy, New York for about four years where he started working on femtosecond laser processing of glass materials. From 2010 until 2013, Yves Bellouard initiated and coordinated the Femtoprint project, a European research initiative aiming at investigating a table-top printer for microsystems ('3D printing of microsystems'). In 2013, he received a prestigious ERC Starting Grant (Consolidator-2012) from the European Research Council and a JSPS Fellowship from the Japan Society for the Promotion of Science. His current research interests are on new paradigms for system integration at the microscale and in particular laser-based methods to tailor material properties for achieving higher level of integration in microsystems, like for instance integrating optics, mechanics and fluidics in a single monolith. These approaches open new opportunities for direct-write methods of microsystems (3D printing). Personal website

Vivek Subramanian

Teaching & PhD PhD Students Giovanni Ruffolo, Giada Romano, Sanjay Manoharan, Kyle Haas, Claude Dahan, Biruktait Ayele Lemecho, Yagmur Ceren Alatas, Tugçe Delipinar Past EPFL PhD Students Amin Hodaei, Mustafa Mohieldin Fadlelmula Fadlelseed Past EPFL PhD Students as codirector Mohammad Jafarpour Courses Organic and printed electronics MICRO-505 This course addresses the implementation of organic and printed electronics technologies using large area manufacturing techniques. It will provide

Official source

Ontological neighbourhood

Computer engineering

Hardware engineering: Microprocessors

Related concepts (32)

Solder

Solder (UKˈsɒldə,_ˈsəʊldə; NA: ˈsɒdər) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.

Soldering

Soldering (USˈsɒdərɪŋ; UKˈsoʊldərɪŋ) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint. Soldering is commonly used in the electronics industry for the manufacture and repair of printed circuit boards (PCBs) and other electronic components. It is also used in plumbing and metalwork, as well as in the manufacture of jewelry and other decorative items.

Integrated circuit packaging

In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.

Integrated circuit

An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.

Multi-chip module

A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".

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Chip Packaging Process Flow: Major Steps

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MEMS Resonators and Oscillators

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