Lecture

Plasma Focused Ion Beam: Applications and Techniques

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In course

MSE-704: 3D Electron Microscopy and FIB-Nanotomography

The principles of 3D surface (SEM) reconstruction and its limitations will be explained. 3D volume reconstruction and tomography methods by electron microscopy (SEM/FIB and TEM) will be explained and compared with x-ray tomography. ...

Description

This lecture covers the principles and applications of Plasma Focused Ion Beam (PFIB) technology, focusing on high-precision imaging and milling techniques using a Helios G4 PFIB system. Topics include SEM and FIB column components, gas injection systems, electrical property studies, and automated system checks. The instructor, Carsten Putzke, demonstrates the use of MultiGIS for material deposition, EasyLift for sample handling, and automated irradiation studies. The lecture emphasizes the importance of accurate sample positioning and system maintenance for optimal results.

Instructors (2)

Marco Cantoni

1982-1988, Diploma course in Experimental Physics (certificate, 28.10.88)ETHZ Faculty IX MATHEMATICS and PHYSICS, Diploma Thesis: "Abweichungen von der ikosaedrischen Symmetrie in Al-Cu-Li Quasikristallen", Advisor: Prof. H.-U. Nissen 1989-1993, Ph.D. in Experimental Physics (certificate, 23.8.94) ETHZ Physics Department, Laboratory of Solid State Physics, Ph. D. Thesis No. 10421, Title: "Elektronenmikroskopische Untersuchung der Realkristallstruktur epitaktischer Schichten von Supraleitern des Typs SEBa2Cu3O7-x auf (100)-SrTiO3" Advisors: Prof. H.R. Ott, Prof. H. U. Nissen. 1994-1996,ETH Zürich,Material Science Department, Non-Metallic Materials, Prof. L. Gauckler: Microstructure characterisation of high-tech ceramic materials by means of SEM, TEM and atomic force microscopy: superconductor thick films (Bi-2212 on Ag) and solid oxide fuel cells (ZrO2, CeO2). 1996-1998, National Institute for Research in Inorganic Materials NIRIM, Japan Group for Special Research, Prof. S. Horiuchi: TEM of Bi-2223/Ag Tapes, Application of Imaging Plates (IP) in High Voltage TEM, Cryo-Lorentz-TEM of Superconducting Materials (Observation of Flux-Lines) 1998-2000, Ecole polytechnique fédéral de Lausanne, EPFL-CIME Centre interdépartemental de microscopie électronique CIME, Prof. P.A. Buffat: Projet 125, PPO II (programme prioritaire optique): Characterization of materials and devices for optic and optoelectronic applications by electron microscopy. 2001-2003, Ecole polytechnique fédéral de Lausanne, EPFL STI IMX LCCeramics Laboratory, Prof. Nava Setter Characterisation of ferroelectric materials, transmission electron microscopy of relaxor ferroelectric materials 2004, University of Geneva, Physics Department, Condensed matter Physics Group of Prof. R. Flükiger, TEM of Multifilament Nb3Sn superconducting wires, in collaboration with EPFL-CIME Since 1.11.04, EPFL-SB-CIME

Lucie Navratilova

Expertise Scanning electron microscopy SEM Dual beam microscope SEM/FIB EDX analysis Teaching & PhD Courses 3D Electron Microscopy and FIB-Nanotomography MSE-704 The principles of 3D surface (SEM) reconstruction and its limitations will be explained. 3D volume reconstruction and tomography methods by electron microscopy (SEM/FIB and TEM) will be explained and compared with x-ray tomography. Scanning electron microscopy techniques (a) MSE-636(a) This intensive course is inten

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Related concepts (31)

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Evaporation (deposition)

Evaporation is a common method of thin-film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state. Evaporation is used in microfabrication, and to make macro-scale products such as metallized plastic film. Evaporation involves two basic processes: a hot source material evaporates and condenses on the substrate. It resembles the familiar process by which liquid water appears on the lid of a boiling pot.

Vacuum deposition

Vacuum deposition , also known as vacuum coating or thin-film deposition, is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e., vacuum). The deposited layers can range from a thickness of one atom up to millimeters, forming freestanding structures. Multiple layers of different materials can be used, for example to form optical coatings.

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Ion source

An ion source is a device that creates atomic and molecular ions. Ion sources are used to form ions for mass spectrometers, optical emission spectrometers, particle accelerators, ion implanters and ion engines. Electron ionization Electron ionization is widely used in mass spectrometry, particularly for organic molecules. The gas phase reaction producing electron ionization is M{} + e^- -> M^{+\bullet}{} + 2e^- where M is the atom or molecule being ionized, e^- is the electron, and M^{+\bullet} is the resulting ion.

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