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Concept

Active packaging

Publications associées (19)

Rapidly verifiable aggregate signatures

Rachid Guerraoui, Manuel José Ribeiro Vidigueira, Matteo Monti, Gauthier Jérôme Timothée Voron, Martina Camaioni, Pierre-Louis Blaise Roman

A method for aggregating digital signatures comprises the following steps carried out by a signature aggregator: receiving first data packages from signers, each first data package comprising a signer identifier, a payload, and a payload signature; verifyi ...

2024

Tunable biocomposite films fabricated using cellulose nanocrystals and additives for food packaging

Wenjing Sun

Cellulose nanocrystals (CNCs) are considered a prospective packaging material to partially replace petroleumbased plastics attributed to their renewability, sustainability, biodegradability, and desirable attributes including transparency, oxygen, and oil ...

ELSEVIER SCI LTD2023

Lignin, from biomass waste to sustainable materials for food packaging, antiviral coatings and agriculture

Alice Boarino

Our planet has been challenged for years by our reckless use of fossil fuels, which has led to the ongoing climate change and energy crisis. The transition to the use of renewable alternative sources has now became urgent and inevitable. The valorization o ...

EPFL2023

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Linear and nonlinear applications of miniaturized silicon nitride microresonators

Arslan Sajid Raja

Photonic integrated circuits (PICs) are the subject of massive interest due to the range of applications they can provide at a huge scale while building on well-established CMOS technologies. One of the critical parameters defining a technology's maturity ...

EPFL2023

Decarbonizing The Production of Primary Aluminium Using Renewable Resource

Aluminium is the second most widely used metal in the world, with a variety of applications ranging from transportation to food packaging and construction. While many aluminium producers target increased utilization of recycled aluminium to produce rolled ...

American Institute of Chemical Engineering2023

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Reversible and Broad-Range Oxygen Sensing Based on Purely Organic Long-Lived Photoemitters

Esther Amstad, Efe Armagan

The detection of oxygen (O-2) by optical sensors is of growing importance, for example, in biology, life science, environmental science, and aerodynamics, where the composition of gases is crucial for many applications. Purely organic optical O-2 sensors a ...

2021

ROS-Neuro: A common middleware for BMI and robotics. The acquisition and recorder packages

José del Rocio Millán Ruiz, Luca Tonin

Recent advances in the Brain-Machine Interface (BMI) and in the robotic fields allowed researchers to design a new generation of brain-actuated neuroprostheses to control a variety of assistive devices-ranging from powered wheelchairs to telepresence robot ...

IEEE2019

Non-contact sub-nanometer optical repositioning using femtosecond lasers

Yves Bellouard

Optical components like resonator or waveguides often have stringent requirements in term of positioning accuracy during packaging. While this can be done routinely in a laboratory environment, permanently positioning and aligning optical elements with nan ...

Optical Society of America2015

Implantable Multi-panel Platform for Continuous Monitoring of Exogenous and Endogenous Metabolites for Applications in Personalized Medicine

Camilla Baj-Rossi

Nowadays, scientific advances are leading to the discovery of newer, better, more targeted treatments that will improve the human health. However, despite the promising results and the major advantages in treatments offered to patients, these personalized ...

EPFL2015

Reliability Aspects of Microelectromechanical Systems for Space Applications : Mechanical Properties of Structural Materials and Analysis of Packaging Strains

Tobias Bandi

Microelectromechanical systems (MEMS) are an essential ingredient in many technological innovations and a source of game-changing inventions in the automotive industry, space exploration, consumer electronics and medical applications due to its capability ...

EPFL2014

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Danick Briand, Yves Pétremand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Thomas Maeder, Peter Ryser, Conor Joseph Slater, Fabrizio Vecchio

An innovative multifunctional LTCC module has been designed for miniature atomic clock packaging. The components of miniature atomic clocks need to be efficiently packaged and connected to each other, and a precise temperature control is required for them. ...

Trans Tech Publications2012

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Thomas Maeder, Peter Ryser, Conor Joseph Slater, Fabrizio Vecchio

Trans Tech Publications Ltd2012

Development of Low-Cost 24-GHz Circuits Exploiting System-in-Package (SiP) Approach and Commercial PCB Technology

Gabriele Tasselli

This paper deals with 24-GHz circuits developed by exploiting a system-in-package approach. In order to reduce the cost as much as possible, a standard multilayer printed circuit board (PCB) technology has been adopted. Such a circuit consists of a package ...

Institute of Electrical and Electronics Engineers2012

CURVACE - CURVed Artificial Compound Eyes

Dario Floreano, Jean-Christophe Zufferey, Michal Karol Dobrzynski, Ramon Pericet Camara, Géraud L'Eplattenier

CURVACE aims at designing, developing, and assessing CURVed Artificial Compound Eyes, a radically novel family of vision systems. This innovative approach will provide more efficient visual abilities for embedded applications that require motion analysis i ...

Elsevier B.V.2011

Electrical modeling and design of a wafer-level package for MEM resonators

Mihai Adrian Ionescu, Anja Skrivervik, Julien Perruisseau-Carrier, Marco Mazza

This paper presents the electrical design and characterization of a wafer-level, or 0-level, package for micro-electromechanical resonators. We start by identifying the requirements on the electrical parasitics of a packaged resonator, derived from an anal ...

Institute of Electrical and Electronics Engineers2010

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

The quantity of MEMS manufacturers has considerably been increasing these last years. This doesn't mean that the introduction of such products on the market has become easier. A packaging operation is needed to obtain a usable product out of a microsystem. ...

EPFL2009