Influence of abrasive concentration on the qualiy of wire-sawn silicon wafers

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GeSn is a promising group-IV semiconductor material for on-chip Si photonics devices and high-mobility transistors. These devices require the use of doped GeSn regions, achieved preferably in situ during epitaxy. From the electronic valence point of view, ...

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Solar cells rely on the efficient generation of electrons and holes and the subsequent collection of these photoexcited charge carriers at spatially separated electrodes. High wafer quality is now commonplace for crystalline silicon (c-Si) based solar cell ...

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The influence of Hf on the heat treatment response of a Laser Powder Bed Fusion (L-PBF) fabricated Ni-base superalloy was investigated. A Hf-free version of CM247LC, CM247LC NHf, and CM247LC (similar to 1.4 wt% Hf) were subjected to identical thermal treat ...

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Influence of abrasive concentration on the qualiy of wire-sawn silicon wafers

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