Bodily implant microelectrode and bodily implant microelectrode fabrication method

The present invention concerns a bodily implantable or probe device and microelectrode fabrication method comprising providing at least one silicon substrate including an electronic device or unit; providing, on a first side of the silicon substrate, at least one conducting material for forming at least one elongated electrical channel of the microelectrode; providing an insulator material on the conducting material to define at least one active site or area of the microelectrode, providing a protection material or layer onto the first side of the silicon substrate or layer; etching the silicon material of a second side of the silicon substrate to form at least one elongated projection extending away from the silicon substrate, the elongated projection comprising the conducting material, and expose an elongated surface of the conducting material of the elongated projection; removing the protection material or layer from the first side of the silicon substrate; and providing a further insulator material on the exposed elongated surface of the conducting material to isolate the elongated electrical channel of the at least one microelectrode, and providing the further insulator material on the etched at least one silicon substrate.