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The present invention relates to a method of producing a FinFET sensor device comprising the steps of: providing a silicon substrate; etching the silicon substrate to produce at least one upwardly extending Fin structure externally protruding from a surface of the silicon substrate; depositing a spacer layer on the at least one Fin structure; anisotropically etching a section of the spacer layer to expose the underlying silicon; isotropic etching of the exposed silicon surrounding the at least one Fin structure; and carrying out oxidation of the silicon surrounding the at least one Fin structure to produce a Fin structure of silicon inside the at least one Fin structure. The present invention also relates to FinFET sensor devices produced by the above method.
Sandro Carrara, Diego Ghezzi, Gian Luca Barbruni
Tobias Kippenberg, Johann Emmeram Riemensberger, Mikhail Churaev, Xinru Ji, Terence Albert Emile Blésin, Chengli Wang, Zihan Li, Junyin Zhang, Xi Wang, Chen Yang, Wil Kao