Publication

Ultra-Thin Piezoelectric Film Optimization

2017
Student Projects

Abstract

This project focused on optimization of the deposition of platinum (Pt) thin films or use in piezoelectric MEMS/NEMS devices. Theory of piezoelectric, DC and DC-pulsed sputtering and thin film characterization was studied. Two parameters were varied in the deposition of the Pt thin films: gas flow and applied target power. Residual stress, resistivity and thickness were characterized. Aluminum nitride (AlN) deposited on top of the Pt thin films was characterized in terms of residual stress and rocking curves through x-ray diffraction (XRD). Initial results showed that as applied target decreased, deposition rate of Pt decreased, while the influence of Ar gas flow was immediately understood. Results of AlN deposited on Pt showed an improved rocking curve for lower Pt sputtering power and gas flow.

Official source

https://infoscience.epfl.ch/entities/publication/38f31c94-972b-4bf7-89ad-8c81420586e8

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2017
Student Projects

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/38f31c94-972b-4bf7-89ad-8c81420586e8

About this result

Related concepts (32)

Thin film

A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. The controlled synthesis of materials as thin films (a process referred to as deposition) is a fundamental step in many applications. A familiar example is the household mirror, which typically has a thin metal coating on the back of a sheet of glass to form a reflective interface. The process of silvering was once commonly used to produce mirrors, while more recently the metal layer is deposited using techniques such as sputtering.

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Pulsed laser deposition

Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.

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Ultra-Thin Piezoelectric Film Optimization

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