Publications by Seniz Esra Küçük

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In this paper, a die-level CMOS post-processing scheme for 3D integration using the via-last approach is presented for multi-layer stacking. The process includes TSV fabrication, chip-to-chip bonding, and finally the TSV filling with Cu electroplating. The ...

We propose a system of narrow FBARs with alternating voltage polarity on top electrodes on the LN platelet and a common bottom floating electrode positioned on a substrate with high acoustic velocity (SiC). This is a YBAR device that is attached to a SiC s ...

This work presents the fabrication and analysis of suspended thin film Lithium Niobate resonators. The yield of the new fabrication process presented below is >90% showing devices with high k(t)(2) of 28% resonators at 5GHz, making them suitable for high f ...

Piezoelectric-based resonators are some of the most used devices in the world. Invisible to most people, they constitute key elements for your mobile phone communications. With the advent of 50, the current technologies for piezoelectric resonators need to ...

In this work, a chip-level post-CMOS processing protocol for 3D integration is presented to achieve multilayer stacking. This protocol includes TSV formation on the top chip, bonding the chips on top of each other, and finally the electrical connection pro ...

Seniz Esra Küçük

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A Chip-Level Post-CMOS Via-Last Cu TSV Process for Multi-Layer Homogeneous 3D Integration

Periodic Structure of Narrow FBARs Operating on SH1 Mode in LN Membrane Solidly Mounted on SiC Substrate

FABRICATION AND ANALYSIS OF THIN FILM LITHUM NIOBATE RESONATORS FOR 5GHz FREQUENCY AND LARGE k(t)(2) APPLICATIONS

Thin Film Devices For 5G Communications

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration