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Publication

A Chip-Level Post-CMOS Via-Last Cu TSV Process for Multi-Layer Homogeneous 3D Integration

Yusuf Leblebici, Seniz Esra Küçük
2016
Conference Papers

Abstract

In this paper, a die-level CMOS post-processing scheme for 3D integration using the via-last approach is presented for multi-layer stacking. The process includes TSV fabrication, chip-to-chip bonding, and finally the TSV filling with Cu electroplating. The proposed process flow is used to fabricate a 4-layer chip stack using homogeneous CMOS memory chips. Electrical measurements are carried out to determine the resistance value of the TSVs. Kelvin bridge method is used in order to eliminate the additional resistance introduced by the experimental setup, and the average resistance value of a single TSV is determined as 180 m Omega. The current carrying capability is also investigated for possible electrical failures. It is concluded that the TSVs can carry up to 1.5 A (DC) current values without any failure.

Official source

https://infoscience.epfl.ch/entities/publication/a6cf6bb4-e5dd-44c1-a6ea-98a021709b02

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Yusuf Leblebici, Seniz Esra Küçük
2016
Conference Papers

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/a6cf6bb4-e5dd-44c1-a6ea-98a021709b02

About this result

Related concepts (16)

Three-dimensional integrated circuit

A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.

Through-silicon via

In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.

Integrated circuit

An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.

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