Lectures related to Packaging of Intelligent Systems

Microcontrollers: Basics and Applications

Covers the basics of microcontrollers, different packaging types, circuit implementation methods, and software tools for circuit design.

Silicon Chip Design

Discusses silicon chip design, metal layer layout, shielding layers, and design challenges.

Cellulose: The New Plastic

Explores cellulose as a sustainable alternative to plastic, focusing on high-performance materials and challenges in replacing plastic packaging.

Semiconductor Nanowire Biosensors

Explores the use of semiconductor nanowires as biosensors for label-free detection of charged analytes, emphasizing high sensitivity and the need for further research.

Analog CMOS Integrated Circuits: Fundamentals

Covers the fundamentals of analog CMOS integrated circuits, emphasizing transistor-level design principles and the historical impact of CMOS technology.

Sustainable Packaging: Transient Electronics

Explores sustainable packaging using transient electronics for biomedical applications and biodegradable environmental monitors.

Circular Materials Economy: Nanocellulose Applications

Delves into circular materials economy and nanocellulose applications in sustainability and various industries.

Neural Electrodes: Materials and Packaging

Covers the evaluation of insulating materials for neural electrodes and the challenges of packaging.

Chip Packaging Process Flow: Major Steps Log in to Mediaspace to watch this video

Covers the major steps in chip packaging and the evolution of packaging technologies.

Packaging of Intelligent Systems Log in to Mediaspace to watch this video

Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.

Advanced MEMS Packaging Log in to Mediaspace to watch this video

Explores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.

MEMS Packaging: 3D Integration & Advanced Technologies Log in to Mediaspace to watch this video

Explores advanced MEMS packaging technologies, including 3D integration, hermetic packaging, and wafer-level packaging processes.

MEMS Packaging: Techniques and Considerations Log in to Mediaspace to watch this video

Explores MEMS packaging techniques, including bonding methods and key considerations for ensuring reliability and functionality.

Infrared Photodetectors: Mercury Cadmium Telluride Technology Log in to Mediaspace to watch this video

Covers the technology and applications of Mercury Cadmium Telluride photoconductors in infrared detection systems.

Soldering and Brazing: Fundamentals and Techniques Log in to Mediaspace to watch this video

Covers soldering and brazing fundamentals, eutectic alloys, joint interfaces, fluxes, aluminum brazing challenges, and hybrid metal-ceramic parts.

MEMS: Advanced Introduction Log in to Mediaspace to watch this video

Covers advanced topics in MEMS technology, including design, packaging, device categories, historical perspective, market trends, and the role of startups.

VLSI: Energy Dissipation in Semiconductor Components Log in to Mediaspace to watch this video

Covers energy dissipation in VLSI chips, focusing on subthreshold current in NMOS transistors and the effects of threshold voltage on power consumption.

Introduction to VLSI: a quick tour Log in to Mediaspace to watch this video

Offers a historical journey through VLSI technology, covering key milestones, challenges, and future prospects in the field.

VLSI Testing: Techniques and Economics Log in to Mediaspace to watch this video

Explores test techniques for digital VLSI systems, covering fault modeling, test-pattern generation, and design for testability.

Test of VLSI Systems Log in to Mediaspace to watch this video

Covers test techniques for digital VLSI systems, including fault modeling and design for testability.