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Lecture

Micro/Nanomechanical Devices: Fabrication Techniques

In course

ME-426: Micro/Nanomechanical devices

In this course we will see an overview of the exciting field of Micro and Nanomechanical systems. We will go over the dfferent scaling laws that dominate the critical parameters, how size affects material properties, how these devices are manufactured, de ...

Description

This lecture covers the fabrication of micro/nanomechanical devices, starting with the release of mechanical parts and the importance of selectivity and avoiding stiction. It explains the transition from micro to nano dimensions, detailing deposition methods, implantation, etching, lithography, and bottom-up growth techniques like CVD and VLS. The lecture emphasizes the critical role of annealing and the challenges in achieving uniformity and reproducibility in fabrication processes.

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Instructor

Luis Guillermo Villanueva Torrijo

Guillermo Villanueva is a Tenure Track Assistant Professor at the Ecole Polytechnique Federale de Lausane (EPFL), Switzerland, in the Mechanical Engineering Institute (IGM). Before joining EPFL he was a Marie Curie post-doctoral scholar at DTU (Denmark) and Caltech (California, US); and before a post-doc at EPFL-LMIS1. He received his M.Sc. in Physics in Zaragoza (Spain) and his PhD from the UAB in Barcelona (Spain). Since the start of his PhD (2002), Prof. Villanueva has been active in the fields of NEMS/MEMS for sensing, having expertise from the design and fabrication to the characterization and applicability. He has co-authored more than 75 papers in peer-reviewed journals (h-index of 24 WoK, 32 GoS) and more than 100 contributions to international conferences. He is serving, or has served, on the program committees of IEEE-NEMS, IEEE-Sensors, MNE, IEEE-FCS and Transducers. He is editor of Microelectronic Engineering. He has co-organized MNE2014 and SNC2015; and he is currently co-organizing the short courses at Transducers 2019 and the 16th International Workshop on Nanomechanical Sensors (NMC2019).

Official source

Related concepts (25)

Etching (microfabrication)

Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography. Other situations require a more durable mask, such as silicon nitride.

Microfabrication

Microfabrication is the process of fabricating miniature structures of micrometre scales and smaller. Historically, the earliest microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device fabrication". In the last two decades microelectromechanical systems (MEMS), microsystems (European usage), micromachines (Japanese terminology) and their subfields, microfluidics/lab-on-a-chip, optical MEMS (also called MOEMS), RF MEMS, PowerMEMS, BioMEMS and their extension into nanoscale (for example NEMS, for nano electro mechanical systems) have re-used, adapted or extended microfabrication methods.

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Evaporation (deposition)

Evaporation is a common method of thin-film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state. Evaporation is used in microfabrication, and to make macro-scale products such as metallized plastic film. Evaporation involves two basic processes: a hot source material evaporates and condenses on the substrate. It resembles the familiar process by which liquid water appears on the lid of a boiling pot.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

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