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Lecture

Thermal Effects

In course

MICRO-470: Scaling laws in micro & nanosystems

This class adresses scaling laws in MEMS/NEMS. The dominant physical effects and scaling effects when downsizing sensors and actuators in microsystems are discussed, across a broad range of actuation principles. ...

Description

This lecture covers the dynamics of thermal effects, including the thermal time constant, thermal conductivity, and dissipated power per volume. It discusses models for convective systems, inkjet heaters, planar heater modeling, micro heaters for gas sensing, PCR for DNA amplification, and thermal proximity sensing. The lecture also explores cooling time constants, IR sources for gas sensing, and electro-thermal actuators. Various examples and applications are presented, such as the 'Millipede' IBM technology and the use of thermal bimorphs in electro-thermal actuators.

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Instructors (3)

Niels Quack

Prof. Dr. Niels Quack received the M.Sc. degree from Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland, in 2005, and the Dr.Sc. degree from Eidgenössische Technische Hochschule Zürich (ETH), Zürich, Switzerland, in 2010. From 2011 to 2015, he was Postdoctoral Researcher and Visiting Scholar with the Integrated Photonics Laboratory, Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, USA. From 2014 to 2015, he was Senior MEMS Engineer with Sercalo Microtechnology, Neuchâtel, Switzerland. He is currently an SNSF Assistant Professor with Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland. He has authored and co-authored more than 50 papers in leading technical journals and conferences. His research interests include photonic micro and nanosystems, with an emphasis on diamond photonics and silicon photonic MEMS. He is Steering Committee Member of the IEEE International Conference on Optical MEMS and Nanophotonics (OMN) and served as General Chair of the IEEE OMN 2018 and the Latsis Symposium 2019 on Diamond Photonics. He is a Senior Member of IEEE, Member of The Optical Society (OSA) and life member of SPIE.

Herbert Shea

Philippe Renaud

Philippe Renaud is Professor at the Microsystem Laboratory (LMIS4) at EPFL. He is also the scientific director of the EPFL Center of MicroNanoTechnology (CMI). His main research area is related to micronano technologies in biomedical applications (BioMEMS) with emphasis on cell-chips, nanofluidics and bioelectronics. Ph. Renaud is invloved in many scientifics papers in his research area. He received his diploma in physics from the University of Neuchâtel (1983) and his Ph.D. degree from the University of Lausanne (1988). He was postdoctoral fellow at University of California, Berkeley (1988-89) and then at the IBM Zürich Research Laboratory in Switzerland (1990-91). In 1992, he joined the Sensors and Actuators group of the Swiss Center for Electronics and Microtechnology (CSEM) at Neuchâtel, Switzerland. He was appointed assistant professor at EPFL in 1994 and full professor in 1997. In summer 1996, he was visiting professor at the Tohoku University, Japan. Ph. Renaud is active in several scientific committee (scientific journals, international conferences, scientific advisory boards of companies, PhD thesis committee). He is also co-founder of the Nanotech-Montreux conference. Ph. Renaud is committed to valorization of basic research through his involvement in several high-tech start-up companies.

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Related concepts (12)

Thermal conductivity

The thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by , , or . Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity. For instance, metals typically have high thermal conductivity and are very efficient at conducting heat, while the opposite is true for insulating materials like mineral wool or Styrofoam.

Thermal management (electronics)

All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.

Thermal comfort

Thermal comfort is the condition of mind that expresses satisfaction with the thermal environment and is assessed by subjective evaluation (ANSI/ASHRAE Standard 55). The human body can be viewed as a heat engine where food is the input energy. The human body will release excess heat into the environment, so the body can continue to operate. The heat transfer is proportional to temperature difference. In cold environments, the body loses more heat to the environment and in hot environments the body does not release enough heat.

Thermal resistance

Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. (Absolute) thermal resistance R in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. Specific thermal resistance or thermal resistivity Rλ in kelvin–metres per watt (K⋅m/W), is a material constant.

Computer cooling

Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, and hard disk drives. Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling.

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