Lecture

Thermal Properties in Materials Science

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In course

MSE-100: Introduction to materials science

This course relates the structural elements of materials to their mechanical, thermal, electric, magnetic, and optical properties. Hands-on laboratories and team projects offer insight into the profession of materials engineers. ...

Description

This lecture covers the impact of temperature on materials, including thermal expansion, thermal conductivity, and specific heat. It delves into concepts such as thermal diffusion, thermal fatigue, and thermo-mechanical constraints. The diffusion of atoms, thermal conductivity, and the influence of temperature on material properties are also discussed.

Instructors (2)

Pierre-Etienne Bourban

Background 1990 Ingénieur en science des matériaux 1993 PhD in materials science Activities 1993-1994 Research at the Center for Composite Materials, University of Delaware, USA (ccm.udel.edu), SNSF grant Since 1994 Research and teaching at EPFL, Composites, (LTC, LPAC) 1995-1999 Coordination Swiss Priority Program on Materials research: 2.2: Composites Since 1998 Biocomposites 2004-2009 Direction of the EPFL Transdisciplinary programme in Sport and Rehabilitation 2005-2008 Member of the EPFL Vice-Presidency for Innovation and Valorisation and direction a.i.EPFL-LTC Since 2016 Direction Discovery Learning Labs Materials/Bioengineering and Engineering

Francesco Stellacci

Francesco Stellacci graduated in Materials Engineering at the Politecnico di Milano in 1998 with a thesis on photochromic polymers with Prof. Giuseppe Zerbi and Mariacarla Gallazzi. In 1999 he moved to the Chemistry Department of the University of Arizona for as a post-doc in the group of Joe Perry in close collaboration with the group of Seth Marder. In 2002 he moved to the Department of Materials Science and Engineering at the Massachusetts Institute of Technology as an assistant professor. He was then promoted to associate without (2006) and with tenure (2009). In 2010 he moved to the Institute of Materials at EPFL as a full Professor. He holds the Alcan EP Chair. Francesco was one of the recipients of the Technology Review TR35 "35 Innovator under 35" award in 2005, and the Popular Science Magazine "Brilliant 10" award in 2007. He has been a Packard Fellow starting 2005.

Official source

Related concepts (32)

Thermal conductivity

The thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by , , or . Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity. For instance, metals typically have high thermal conductivity and are very efficient at conducting heat, while the opposite is true for insulating materials like mineral wool or Styrofoam.

Thermal resistance

Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. (Absolute) thermal resistance R in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. Specific thermal resistance or thermal resistivity Rλ in kelvin–metres per watt (K⋅m/W), is a material constant.

Thermal insulation

Thermal insulation is the reduction of heat transfer (i.e., the transfer of thermal energy between objects of differing temperature) between objects in thermal contact or in range of radiative influence. Thermal insulation can be achieved with specially engineered methods or processes, as well as with suitable object shapes and materials. Heat flow is an inevitable consequence of contact between objects of different temperature.

Thermal conduction

Conduction is the process by which heat is transferred from the hotter end to the colder end of an object. The ability of the object to conduct heat is known as its thermal conductivity, and is denoted k. Heat spontaneously flows along a temperature gradient (i.e. from a hotter body to a colder body). For example, heat is conducted from the hotplate of an electric stove to the bottom of a saucepan in contact with it.

Thermal management (electronics)

All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.

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