Lecture

Energy-Efficiency in Datacenters

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Description

This lecture discusses the energy-efficiency in datacenters, focusing on the challenges and solutions to reduce power consumption and heat generation. It covers topics such as the advantages of 3D vs. 2D Multi-Processor System-on-Chip (MPSoCs), run-time heat spreading, liquid cooling technologies, and predictive energy management. The presentation also delves into the design of 3D MPSoCs with advanced cooling, thermal modeling, and active cooling management strategies. Various experiments and comparisons are presented to showcase the effectiveness of different thermal management approaches in achieving energy efficiency and reducing hotspots.

Official source

Ontological neighbourhood

Mechanical engineering

Thermal engineering: Air conditioning

Related concepts (32)

Thermal management (electronics)

All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.

Water cooling

Water cooling is a method of heat removal from components and industrial equipment. Evaporative cooling using water is often more efficient than air cooling. Water is inexpensive and non-toxic; however, it can contain impurities and cause corrosion. Water cooling is commonly used for cooling automobile internal combustion engines and power stations. Water coolers utilising convective heat transfer are used inside high-end personal computers to lower the temperature of CPUs and other components.

Computer cooling

Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, and hard disk drives. Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling.

Internal combustion engine cooling

Internal combustion engine cooling uses either air or liquid to remove the waste heat from an internal combustion engine. For small or special purpose engines, cooling using air from the atmosphere makes for a lightweight and relatively simple system. Watercraft can use water directly from the surrounding environment to cool their engines. For water-cooled engines on aircraft and surface vehicles, waste heat is transferred from a closed loop of water pumped through the engine to the surrounding atmosphere by a radiator.

Energy conversion efficiency

Energy conversion efficiency (η) is the ratio between the useful output of an energy conversion machine and the input, in energy terms. The input, as well as the useful output may be chemical, electric power, mechanical work, light (radiation), or heat. The resulting value, η (eta), ranges between 0 and 1. Energy conversion efficiency depends on the usefulness of the output. All or part of the heat produced from burning a fuel may become rejected waste heat if, for example, work is the desired output from a thermodynamic cycle.

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