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Concept

Integrated circuit packaging

Related publications (28)

Eco-Conscious Approach to Wireless Gas Monitoring With a Hybrid Printed Passive Sensor Tag

Sandro Carrara, Johanna Zikulnig

Addressing the environmental impact of electronic waste in biomedical sensing, an eco-conscious approach to the realization of a Chitosan-based Acetone sensor tag for wireless gas monitoring is presented. The fabrication involves inkjet printing of silver ...

Ieee-Inst Electrical Electronics Engineers Inc2024

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Electronic metadevices for terahertz applications

Elison de Nazareth Matioli, Mohammad Samizadeh Nikooytabalvandani

The evolution of electronics has largely relied on downscaling to meet the continuous needs for faster and highly integrated devices(1). As the channel length is reduced, however, classic electronic devices face fundamental issues that hinder exploiting ma ...

NATURE PORTFOLIO2023

Digital manufacturing of personalised footwear with embedded sensors

Danick Briand, Rubaiyet Iftekharul Haque, Jaemin Kim, Ryan Mitchell van Dommelen

The strong clinical demand for more accurate and personalized health monitoring technologies has called for the development of additively manufactured wearable devices. While the materials palette for additive manufacturing continues to expand, the integra ...

Nature Research2023

Integrated silicon photonic MEMS

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari

Silicon photonics has emerged as a mature technology that is expected to play a key role in critical emerging applications, including very high data rate optical communications, distance sensing for autonomous vehicles, photonic-accelerated computing, and ...

SPRINGERNATURE2023

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Kilowatt-range Picosecond Switching Based on Microplasma Devices

Elison de Nazareth Matioli, Remco Franciscus Peter van Erp, Armin Jafari, Mohammad Samizadeh Nikooytabalvandani

Plasma formation in micro- and nano-scales enables an ultrahigh-dv/dt picosecond switching in an integrated circuit form factor. Such on-chip plasma devices could provide a transformative approach to achieving high-power levels at very high frequencies, fa ...

Institute of Electrical and Electronics Engineers2021

A massively scalable Time-to-Digital Converter with a PLL-free calibration system in a commercial 130 nm process

Edoardo Charbon

A 33.6 ps LSB Time-to-Digital converter was designed in 130 nm BiCMOS technology. The core of the converter is a differential 9-stage ring oscillator, based on a multi-path architecture. A novel version of this design is proposed, along with an analytical ...

IOP Publishing Ltd2021

Embedded Microchannel Cooling for Monolithically-integrated GaN Half-bridge ICs

Elison de Nazareth Matioli, Luca Nela, Remco Franciscus Peter van Erp, Palliyage Srilak Nirmana Perera

Efficient and compact power conversion is a key requirement to achieve sustainable electrification of our society. GaN-based power devices offer major benefits compared to their silicon counterparts in terms of efficiency and integration but suffer from se ...

IEEE2021

Microwave-to-Optical Transduction with Gallium Phosphide Electro-Optomechanical Devices

Simon Benjamin Klaus Hönl

Quantum computing is one of the great scientific challenges of the 21st century. Small-scale systems today promise to surpass classical computers in the coming years and to enable the solution of classically intractable computational tasks in the fields of ...

EPFL2021

Integration of hybrid material systems in conformable neural interfaces

Florian Dylan Fallegger

Neural interfaces are devices that are implanted into the body and interface electrically with the central (CNS) or peripheral nervous system. They are inserted surgically for short periods of time or chronically to diagnose or treat several neural disease ...

EPFL2020

Ultra-compact, high-frequency power integrated circuits based on GaN-on-Si Schottky Barrier Diodes

Elison de Nazareth Matioli, Jun Ma, Luca Nela, Remco Franciscus Peter van Erp, Georgios Kampitsis

GaN transistors are being employed in an increasing number of applications thanks to their excellent performance and competitive price. Yet, GaN diodes are not commercially available and little is known about their performance and potential impact on power ...

2020

Chip-based soliton microcomb module using a hybrid semiconductor laser

Tobias Kippenberg, Junqiu Liu, Rui Ning Wang, Erwan Guillaume Albert Lucas, Jijun He, Arslan Sajid Raja, Nicolas Volet

Photonic chip-based soliton microcombs have shown rapid progress and have already been used in many system-level applications. There has been substantial progress in realizing soliton microcombs that rely on compact laser sources, culminating in devices th ...

2020

Visual Attention and Perceptual Quality in Omnidirectional Imaging

Evgeniy Upenik

Omnidirectional imaging has reached a level of widespread availability driven by recent advances in integrated circuit technology, image sensors, and computer graphics which allow now capturing, rendering and displaying of such type of immersive content in ...

EPFL2020

Electron paramagnetic resonance magnetic field sensors for particle accelerators

Giovanni Boero, Alessandro Valentino Matheoud, Anthony Jean Beaumont

We report on four electron paramagnetic resonance sensors for dynamic magnetic field measurements at 36 mT, 100 mT, 360 mT, and 710 mT. The sensors are based on grounded co-planar microwave resonators operating at about 1 GHz and 3 GHz, realized using prin ...

2020

i-DPs CGRA: An Interleaved-Datapaths Reconfigurable Accelerator for Embedded Bio-signal Processing

David Atienza Alonso, Giovanni Ansaloni, Miguel Peon Quiros, Soumya Subhra Basu, Loris Gérard Duch

Smart edge sensors for bio-signal monitoring must support complex signal processing routines within an extremely small energy envelope. Coarse-Grained Reconfigurable Arrays (CGRAs) are good candidates for tackling these conflicting objectives because, than ...

2019

Scaling Printable Zn-Ag2O Batteries for Integrated Electronics

Vivek Subramanian

Printed batteries are an emerging solution for integrated energy storage using low-cost, high accuracy fabrication techniques. While several printed batteries have been previously shown, few have designed a battery that can be incorporated into an integrat ...

WILEY-V C H VERLAG GMBH2019

ReRAM From Material Study to CMOS Co-integration

Elmira Shahrabi

The revolution of information-technology owes to silicon-based complementary-metal-oxide (CMOS) technology. However, CMOS technology approaches its physical limitation hardening the further progress of memory devices as well as computing paradigm requiring ...

EPFL2019

On Advanced Large-Field Photolithography

Raoul Kirner

The information age we live in today relies on highly integrated devices. They are fabricated with the help of photolithography, the patterning technique at the heart of their production. With the continuous demand for higher integration density to achieve ...

EPFL2019

Two-Element Antenna-Active Phase Shifter Packaging at 77 GHz

Anja Skrivervik, Mirmehdi Seyyedesfahlan

This work presents a low cost and wire-bonded active phase shifter chip to RF circuitry on PCB board packaging for implementing a two-element phased array antenna at 77 GHz. The 1.5 mm × 1.1 mm chip is embedded in RO3003 PCB board and its GSG ports are wir ...

IEEE2019