Publication

High-efficiency non-ablative UV laser nano-scale processing of fused silica by stable filamentation

Publications associées (26)

In-Plane Fabricated Insulated Gold-Tip Probe For Electrochemical And Molecular Experiments

Nico de Rooij, Terunobu Akiyama, Sebastian Gautsch, Peter Van der Wal, Yexian Wu

In this contribution we present a scanning probe with a gold-tip completely encapsulated with insulator all the way to the apex. The probe fabrication is unique owing to an in-plane arrangement in which the width of the cantilever is defined by deep reacti ...

IEEE2013

Highly soluble energy relay dyes for dye-sensitized solar cells

Michael Graetzel, Jun Ho Yum

High solubility is a requirement for energy relay dyes (ERDs) to absorb a large portion of incident light and significantly improve the efficiency of dye-sensitized solar cells (DSSCs). Two benzonitrile-soluble ERDs, BL302 and BL315, were synthesized, char ...

Royal Society of Chemistry2013

Deep-ultraviolet picosecond flat-top pulses by chirp-matched sum frequency generation

Christoph Peter Hauri

Picosecond, flat-top, deep-UV pulses are needed to generate high-brightness electron beams to efficiently drive x-ray free electron lasers. Current metal photocathodes have low efficiency and therefore require high-energy pulses, and the generation of high ...

2012

All-stencil transistor fabrication on 3D silicon substrates

Philippe Langlet, Cyrille Hibert, Peter Vettiger, Jürgen Brugger, Oscar Vazquez Mena, Katrin Sidler Arnet, Andreea Veronica Savu, Luis Guillermo Villanueva Torrijo, Cristina Martin Olmos

The standard lithographic techniques to fabricate electronic components involve the use of polymers, baking steps and chemicals. This typically restricts their application to flat substrates made up of standard materials. Stencil lithography has been propo ...

Iop Publishing Ltd2012

3D Integration Technology for Lab-on-a-Chip Applications

Yüksel Temiz

This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...

EPFL2012

SiN membranes with submicrometer hole arrays patterned by wafer-scale nanosphere lithography

Jürgen Brugger, Nicolas Blondiaux, Harry Heinzelmann, Oscar Vazquez Mena, Andreea Veronica Savu, Mona Julia Katharina Klein, Raphaël Pugin, Franck Montagne

In this work, nanosphere lithography was integrated with standard microfabrication for the wafer-scale fabrication of silicon nitride (SiN) membranes with arrays of submicrometer holes. A monolayer of polystyrene (PS) beads with a mean diameter of 428 or 5 ...

2011