Publication

Clock Distribution Networks in 3-D Integrated Systems

Publications associées (28)

Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications

Through silicon vias (TSVs) are key enablers of 3-D integration technologies which, by vertically stacking and interconnecting multiple chips, achieve higher performances, lower power, and a smaller footprint. Copper is the most commonly used conductor to ...

Institute of Electrical and Electronics Engineers2017

Copper TSV-Based Process Development for Die-Level Homogeneous and Heterogeneous 3D Integration Platform

Seniz Esra Küçük

Research and development efforts on chip and wafer-scale 3D integration for system miniaturization have been continuing for more than a decade. However, there are still only a handful of 3D integrated products available in the market due to the high cost a ...

EPFL2017

Design Techniques for Ultra High Frequency Clock Generation in 28 nm FDSOI Technology

Hasene Gülperi Özsema

Twentieth century has been the golden age of semiconductor industry by achieving a high level of growth as a courtesy of developments in fabrication techniques and downscaling of the technology. Since the downscaling in current lithography technology is re ...

EPFL2017

Design and Analysis of Jitter-Aware Low-Power and High-Speed TSV Links for 3D ICs

Yusuf Leblebici, Giovanni De Micheli, Alessandro Cevrero, Giulia Beanato, Kiarash Gharibdoust

This paper presents a circuit-level design and analysis of high-data-rate 3D serial vertical links which exploit the high bandwidth provided by TSV technology. As most of the existing TSVs consume a large amount of die area, the serial configuration can sa ...

Elsevier2016

Method for speeding up boolean satisfiability

Giovanni De Micheli, Luca Gaetano Amarù, Pierre-Emmanuel Julien Marc Gaillardon

A method for transforming a tautology check of an original logic circuit into a contradiction check of the original logic circuit and vice versa comprises interpreting the original logic circuit in terms of AND, OR, MAJ, MIN, XOR, XNOR, INV original logic ...

2016

Robustness Analysis of Controllable-Polarity Silicon Nanowire Devices and Circuits

Hassan Ghasemzadeh Mohammadi

Substantial downscaling of the feature size in current CMOS technology has confronted digital designers with serious challenges including short channel effect and high amount of leakage power. To address these problems, emerging nano-devices, e.g., Silicon ...

EPFL2016

Impact of Data Serialization over TSVs on Routing Congestion in 3D-Stacked Multi-Core Processors

Yusuf Leblebici, Giovanni De Micheli, Alessandro Cevrero, Giulia Beanato

3D integration can alleviate routing congestion, reducing the wirelength and improving performances. Nevertheless, each TSV still occupies non-negligible silicon area: as the number of TSV increases, their effect on the chip routing is detrimental. The red ...

Elsevier2016

DynOR: A 32-bit Microprocessor in 28 nm FD-SOI with Cycle-By-Cycle Dynamic Clock Adjustment

Andreas Peter Burg, Lorenz Flavio Schmid, Jeremy Hugues-Felix Constantin, Andrea Bonetti, Adam Shmuel Teman, Thomas Christoph Müller

This paper presents DynOR, a 32-bit 6-stage OpenRISC microprocessor with dynamic clock adjustment. To alleviate the issue of unused dynamic timing margins, the clock period of the processor is adjusted on a cycle-by-cycle level, based on the instruction ty ...

Ieee2016