Advanced Sensor Systems by Low-Temperature Heterogeneous 3D Integration Processes

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A new hole-transporting material (XJ-05) based on a 9,9'-bicarbazole core and four acetylene-linked triphenylamine groups was designed and applied for perovskite solar cells (PSCs). Optical spectra, thermal stability, electrochemical properties, density fu ...

Distributed plasticity Euler-Bernoulli fiber beams are regularly used by researchers and practitioners to simulate the nonlinear seismic response of reinforced concrete framed structures. This study presents a sensitivity analysis, combining newly proposed ...

Liquid-liquid microfluidic systems rely on the intricate control over the fluid properties of either miscible or immiscible mixtures. Herein, we report on the use of partially miscible binary liquid mixtures that lend their microfluidic properties from a h ...

LoRa is the proprietary physical layer (PHY) of LoRaWAN, which is a popular Internet-of-Things (IoT) protocol enabling low-power devices to communicate over long ranges. A number of reverse engineering attempts have been published in the last few years tha ...

The present contribution reviews the recent progress related to the influence of Icosahedral Short-Range Order (ISRO) and icosahedral Quasicrystals (i-QC) formation on the solidification of fcc alloys through minor solute element additions. From intensive ...

Inspired by the introduction of Volumetric Modeling via volumetric representations (V-reps) by Massarwi and Elber in 2016, in this paper we present a novel approach for the construction of isogeometric numerical methods for elliptic PDEs on trimmed geometr ...

Various bias-correction methods such as EXTRA, DIGing, and exact diffusion have been proposed recently to solve distributed deterministic optimization problems. These methods employ constant step-sizes and converge linearly to the exact solution under prop ...

The methanation of carbon dioxide is an option for chemical storage of renewable energy together with greenhouse gas reutilization because it offers a product with a high energy density. The reaction CO2 + 4H(2) CH4 + 2H(2)O is performed on a Ru/Al2O3 cata ...

The advent of 3D stacked ICs with accumulating heat fluxes stresses thermal reliability and is responsible for temperature driven performance deterioration of the electronic systems Hot spots with power densities typically rising up to 250 W/cm2 are not ac ...

State-of-the-art devices in the consumer electronics market are relying more and more on Multi-Processor Systems-On-Chip (MPSoCs) as an efficient solution to meet their multiple design constrains, such as low cost, low power consumption, high performance a ...

Advanced Sensor Systems by Low-Temperature Heterogeneous 3D Integration Processes

Chattez avec Graph Search

An Acetylene-Linked 9,9 '-Bicarbazole-Based Hole-Transporting Material for Efficient Perovskite Solar Cells

Shake Table Blind Prediction Tests: Contributions for Improved Fiber-based Frame Modelling

Microfluidics of binary liquid mixtures with temperature-dependent miscibility

An Open-Source LoRa Physical Layer Prototype on GNU Radio

Influence of minor additions on Icosahedral Short-Range Order (ISRO) and its consequences on nucleation and solidification growth kinetics in fcc alloys

Isogeometric Analysis on V-reps: First results

On the Performance of Exact Diffusion over Adaptive Networks

Parametric sensitivity in the Sabatier reaction over Ru/Al2O3 - theoretical determination of the minimal requirements for reactor activation

Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries

Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling