Publications associées à An analysis of destination choice for opaque airline products using multidimensional binary logit models

Publications associées (29)

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

Tunable biocomposite films fabricated using cellulose nanocrystals and additives for food packaging

Wenjing Sun

Cellulose nanocrystals (CNCs) are considered a prospective packaging material to partially replace petroleumbased plastics attributed to their renewability, sustainability, biodegradability, and desirable attributes including transparency, oxygen, and oil ...

ELSEVIER SCI LTD2023

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Lignin, from biomass waste to sustainable materials for food packaging, antiviral coatings and agriculture

Alice Boarino

Our planet has been challenged for years by our reckless use of fossil fuels, which has led to the ongoing climate change and energy crisis. The transition to the use of renewable alternative sources has now became urgent and inevitable. The valorization o ...

EPFL2023

System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Joshua Alexander Harrison Klein, Rafael Medina Morillas

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...

2023

Linear and nonlinear applications of miniaturized silicon nitride microresonators

Arslan Sajid Raja

Photonic integrated circuits (PICs) are the subject of massive interest due to the range of applications they can provide at a huge scale while building on well-established CMOS technologies. One of the critical parameters defining a technology's maturity ...

EPFL2023

Representing location choice within activity-based models

Michel Bierlaire, Timothy Michael Hillel, Janody Pougala

Since the 70s, there has been a growing interest in activity-based modelling. This approach models the need to travel as a result of performing daily activities (Bowman and Ben-Akiva, 2001). Nevertheless, the activities need to be scheduled which involves ...

2022

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Tensile response of textile reinforced concrete

Aurelio Muttoni, Miguel Fernández Ruiz, Patrick Lorenzo Valeri

Textile Reinforced Concrete (TRC) is a cementitious composite material where a carbon or glass fabric is embedded as reinforcement. The use of TRC allows building thin and light structures, with reduced concrete covers and an enhanced durability due to the ...

2020

Chip-based soliton microcomb module using a hybrid semiconductor laser

Tobias Kippenberg, Junqiu Liu, Rui Ning Wang, Erwan Guillaume Albert Lucas, Jijun He, Arslan Sajid Raja, Nicolas Volet

Photonic chip-based soliton microcombs have shown rapid progress and have already been used in many system-level applications. There has been substantial progress in realizing soliton microcombs that rely on compact laser sources, culminating in devices th ...

2020

Rapid identification and interpretation of gene‐environment associations using the new R.SamBada landscape genomics pipeline

Stéphane Joost, Kevin Leempoel, Sylvie Stucki, Estelle Rochat, Oliver Michele Selmoni, Elia Vajana, Solange Catherine Gaillard

Samβada is a genome‐environment association (GEA) software, designed to search for signatures of local adaptation. However, pre‐ and post‐processing of data can be labour‐intensive, preventing wider uptake of the method. We have now developed R.SamBada, an ...

2019

Learning-Based Hardware Design for Data Acquisition Systems

Cosimo Aprile

This multidisciplinary research work aims to investigate the optimized information extraction from signals or data volumes and to develop tailored hardware implementations that trade-off the complexity of data acquisition with that of data processing, conc ...

EPFL2018

Competitive ion-exchange of manganese and gadolinium in titanate nanotubes

László Forró, Bálint Náfrádi, Endre Horvath, Márton Kollár, Péter Szirmai, Luka Ciric

Homogeneous Mn2+ and Gd3+ intercalation of scroll-type trititanate nanotubes using a post-synthesis ion exchange method is reported. Compared to Mn2+, Gd3+ ion-exchange shows larger saturation intercalation levels. Upon co-doping, weak interactions between ...

Elsevier Science Bv2017

Zinc blende-wurtzite polytypism in nanocrystalline ZnO films

Christophe Ballif, Cécile Hébert, Aïcha Hessler-Wyser, Duncan Thomas Lindsay Alexander, Sylvain Nicolay, Arthur Brian Aebersold, Lorenzo Fanni

ZnO is commonly observed and assumed to crystallize fully in a wurtzite structure. Indeed, While polytypism between a wurtzite and a zinc blende phase is often seen in some II-VI compounds, it has only rarely been observed in ZnO. Here, by means of automat ...

Elsevier2017

Copper TSV-Based Process Development for Die-Level Homogeneous and Heterogeneous 3D Integration Platform

Seniz Esra Küçük

Research and development efforts on chip and wafer-scale 3D integration for system miniaturization have been continuing for more than a decade. However, there are still only a handful of 3D integrated products available in the market due to the high cost a ...

EPFL2017

LCA of bioethanol and furfural production from vetiver

Edgard Gnansounou, Jegannathan Kenthorai Raman

In this study a prospective life cycle assessment of biorefinery system from vetiver leaves was carried out to know the environmental benefits of this system over conventional systems considering the geographical context of India. The composition of vetive ...

Elsevier2015

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Michel Rappaz, Aïcha Hessler-Wyser, Léa Deillon

Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...

Institute of Physics2015

Activity choice modeling for pedestrian facilities

Antonin Danalet

This thesis develops models of activity and destination choices in pedestrian facilities from WiFi traces. We adapt the activity-based travel demand analysis of urban mobility to pedestrians and to digital footprints. We are interested in understanding the ...

EPFL2015

Detecting abnormal trading activities in option markets

Loriano Mancini

We develop an econometric method to detect "abnormal trades" in option markets, i.e., trades which are not driven by liquidity motives. Abnormal trades are characterized by unusually large increments in open interest, trading volume, and option returns, an ...

Elsevier2015

Reliability Aspects of Microelectromechanical Systems for Space Applications : Mechanical Properties of Structural Materials and Analysis of Packaging Strains

Tobias Bandi

Microelectromechanical systems (MEMS) are an essential ingredient in many technological innovations and a source of game-changing inventions in the automotive industry, space exploration, consumer electronics and medical applications due to its capability ...

EPFL2014