Publications related to An analysis of destination choice for opaque airline products using multidimensional binary logit models

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

Tunable biocomposite films fabricated using cellulose nanocrystals and additives for food packaging

Cong Chen, Wenjing Sun

Cellulose nanocrystals (CNCs) are considered a prospective packaging material to partially replace petroleumbased plastics attributed to their renewability, sustainability, biodegradability, and desirable attributes including transparency, oxygen, and oil ...

ELSEVIER SCI LTD2023

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Lignin, from biomass waste to sustainable materials for food packaging, antiviral coatings and agriculture

Alice Boarino

Our planet has been challenged for years by our reckless use of fossil fuels, which has led to the ongoing climate change and energy crisis. The transition to the use of renewable alternative sources has now became urgent and inevitable. The valorization o ...

EPFL2023

System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Joshua Alexander Harrison Klein, Rafael Medina Morillas

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...

2023

Linear and nonlinear applications of miniaturized silicon nitride microresonators

Arslan Sajid Raja

Photonic integrated circuits (PICs) are the subject of massive interest due to the range of applications they can provide at a huge scale while building on well-established CMOS technologies. One of the critical parameters defining a technology's maturity ...

EPFL2023

Representing location choice within activity-based models

Michel Bierlaire, Janody Pougala, Nicolas Jean Salvadé, Timothy Michael Hillel

Since the 70s, there has been a growing interest in activity-based modelling. This approach models the need to travel as a result of performing daily activities (Bowman and Ben-Akiva, 2001). Nevertheless, the activities need to be scheduled which involves ...

2022

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Göran Stemme, Hamed Sattari, Alain Yuji Takabayashi

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Chip-based soliton microcomb module using a hybrid semiconductor laser

Nicolas Volet, Rui Ning Wang, Tobias Kippenberg, Erwan Guillaume Albert Lucas, Junqiu Liu, Arslan Sajid Raja, Jijun He

Photonic chip-based soliton microcombs have shown rapid progress and have already been used in many system-level applications. There has been substantial progress in realizing soliton microcombs that rely on compact laser sources, culminating in devices th ...

2020

Rapid identification and interpretation of gene‐environment associations using the new R.SamBada landscape genomics pipeline

Stéphane Joost, Sylvie Stucki, Estelle Rochat, Solange Catherine Gaillard, Oliver Michele Selmoni, Kevin Leempoel, Elia Vajana

Samβada is a genome‐environment association (GEA) software, designed to search for signatures of local adaptation. However, pre‐ and post‐processing of data can be labour‐intensive, preventing wider uptake of the method. We have now developed R.SamBada, an ...

2019

Learning-Based Hardware Design for Data Acquisition Systems

Cosimo Aprile

This multidisciplinary research work aims to investigate the optimized information extraction from signals or data volumes and to develop tailored hardware implementations that trade-off the complexity of data acquisition with that of data processing, conc ...

EPFL2018

Copper TSV-Based Process Development for Die-Level Homogeneous and Heterogeneous 3D Integration Platform

Seniz Esra Küçük

Research and development efforts on chip and wafer-scale 3D integration for system miniaturization have been continuing for more than a decade. However, there are still only a handful of 3D integrated products available in the market due to the high cost a ...

EPFL2017

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Aïcha Hessler-Wyser, Thierry Hessler, Michel Rappaz, Léa Deillon

Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...

Institute of Physics2015

Activity choice modeling for pedestrian facilities

Antonin Danalet

This thesis develops models of activity and destination choices in pedestrian facilities from WiFi traces. We adapt the activity-based travel demand analysis of urban mobility to pedestrians and to digital footprints. We are interested in understanding the ...

EPFL2015

Reliability Aspects of Microelectromechanical Systems for Space Applications : Mechanical Properties of Structural Materials and Analysis of Packaging Strains

Tobias Bandi

Microelectromechanical systems (MEMS) are an essential ingredient in many technological innovations and a source of game-changing inventions in the automotive industry, space exploration, consumer electronics and medical applications due to its capability ...

EPFL2014

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

John Richard Thome, Yassir Madhour, Jackson Braz Marcinichen, Bruno Michel, Brian Paul D'Entremont

Three-dimensional (3D) stacking of integrated-circuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with area-array through-silicon-vias (TSVs). This reduces the length of global interconnects and t ...

American Society of Mechanical Engineers2014

High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS

Nico de Rooij, Danick Briand, Terunobu Akiyama, Rokhaya Gueye

A System-in-Package (SiP) concept for the 3D-integration of a Single Wall Carbon Nanotube (SWCNT) resonator with its CMOS driving electronics is presented. The key element of this advanced SiP is the monolithic 3D-integration of the MEMS with the CMOS elec ...

SPIE - International Society of Optical Engineering2013

An empirical comparison of travel choice models that capture preferences for compromise alternatives

Michel Bierlaire

Compromise alternatives have an intermediate performance on each or most attributes rather than having a poor performance on some attributes and a strong performance on others. The relative popularity of compromise alternatives among decision-makers has be ...

Springer2013

Integrated packaging solutions and hotplates for a miniature atomic clock and other microsystems

Fabrizio Vecchio

This thesis aimed at developing innovative packaging solutions for a miniature atomic clock and other microsystems in the cm-scale, i.e. somewhat larger than what is practical for full "chip-scale" device-package integration using clean-room technologies f ...

EPFL2013