Publications associées à Copper TSV-Based Process Development for Die-Level Homogeneous and Heterogeneous 3D Integration Platform

Publications associées (34)

Highly Stable Low‐Temperature Phosphate Glass as a Platform for Multimaterial 3D Printing of Integrated Functional Microfluidic Devices

The monolithic fabrication of microfluidic systems using additive manufacturing technology offers a promising route for integrating the multifunctionality essential to these devices. However, this approach faces key challenges, primarily due to the limited ...

Wiley2025

Towards Scalable Electronics: Synthetic 2D Materials for Large-Area 2D Circuit Integration

Zhenyu Wang

In the past decades, a significant increase of the transistor density on a chip has led to exponential growth in computational power driven by Moore's law. To overcome the bottleneck of traditional von-Neumann architecture in computational efficiency, effo ...

EPFL2024

Thermo-optic epsilon-near-zero effects

Camille Sophie Brès, Marco Clementi, Jiaye Wu

Nonlinear epsilon-near-zero (ENZ) nanodevices featuring vanishing permittivity and CMOS-compatibility are attractive solutions for large-scale-integrated systems-on-chips. Such confined systems with unavoidable heat generation impose critical challenges fo ...

Nature Portfolio2024

Generation of entangled photon pairs from a silicon bichromatic photonic crystal cavity

Matteo Galli, Marco Clementi

Integrated quantum photonics leverages the on-chip generation of nonclassical states of light to realize key functionalities of quantum devices. Typically, the generation of such nonclassical states relies on whispering gallery mode resonators, such as int ...

Aip Publishing2024

Eco-Conscious Approach to Wireless Gas Monitoring With a Hybrid Printed Passive Sensor Tag

Sandro Carrara, Johanna Zikulnig

Addressing the environmental impact of electronic waste in biomedical sensing, an eco-conscious approach to the realization of a Chitosan-based Acetone sensor tag for wireless gas monitoring is presented. The fabrication involves inkjet printing of silver ...

Ieee-Inst Electrical Electronics Engineers Inc2024

Multi-Ported GC-eDRAM Bitcell with Dynamic Port Configuration and Refresh Mechanism

Adam Shmuel Teman, Robert Giterman

Embedded memories occupy an increasingly dominant part of the area and power budgets of modern systems-on-chips (SoCs). Multi-ported embedded memories, commonly used by media SoCs and graphical processing units, occupy even more area and consume higher pow ...

MDPI2024

Advanced Silicon and SWIR Single-Photon Avalanche Diodes: Design, Simulation, and Characterization

Ekin Kizilkan

Low-level light detection with high spatial and timing accuracy is a growing area of interest by virtue of applications such as light detection and ranging (LiDAR), biomedical imaging, time-resolved Raman spectroscopy, and quantum applications. Single-phot ...

EPFL2024

Integrated Wireless Power, Data Communication, and Thermal Sensing System for Autonomous Multisite Brain Implants

Mohammad Javad Karimi

Implanted medical devices (IMDs) have been widely developed to support the monitoring and recording of biological data inside the body or brain. Wirelessly powered IMDs, a subset of implantable electronics, have been proposed to eliminate the limitations r ...

EPFL2024

Accelerator-driven Data Arrangement to Minimize Transformers Run-time on Multi-core Architectures

David Atienza Alonso, Giovanni Ansaloni, Alireza Amirshahi

The increasing complexity of transformer models in artificial intelligence expands their computational costs, memory usage, and energy consumption. Hardware acceleration tackles the ensuing challenges by designing processors and accelerators tailored for t ...

2024

A modular multiple frequency inductive link to wirelessly power multiple miniaturized implants

Sandro Carrara, Diego Ghezzi, Gian Luca Barbruni

A modular multiple frequency coils inductive link system to wirelessly provide power for at least a medical implant at an output of a receiving coil, whereby the receiving coil is configured to be implanted in an organism. The modular multiple frequency co ...

2024

Lithium tantalate photonic integrated circuits for volume manufacturing

Tobias Kippenberg, Johann Emmeram Riemensberger, Mikhail Churaev, Xinru Ji, Zihan Li, Terence Albert Emile Blésin, Chengli Wang, Junyin Zhang, Xi Wang, Chen Yang, Wil Kao, Alisa Davydova

Electro-optical photonic integrated circuits (PICs) based on lithium niobate (LiNbO3) have demonstrated the vast capabilities of materials with a high Pockels coefficient1,2. They enable linear and high-speed modulators operating at complementary metal–oxi ...

2024

Contemporary Logic Synthesis: with an Application to AQFP Circuit Optimization

Siang-Yun Lee

Electronic devices play an irreplaceable role in our lives. With the tightening time to market, exploding demand for computing power, and continuous desire for smaller, faster, less energy-consuming, and lower-cost chips, computer-aided design for electron ...

EPFL2024

Development of Electrical and Optical Packaging for Silicon Photonic MEMS

Niels Quack

We demonstrate a packaging approach to integrate electrical and optical connections in silicon photonic MEMS, utilizing a custom-designed silicon interposer for routing over 118 electrical connections and a 72 channel fiber array to couple to on-chip fiber ...

Institute of Electrical and Electronics Engineers Inc.2024

EdgeAI-Aware Design of In-Memory Computing Architectures

Marco Antonio Rios

Driven by the demand for real-time processing and the need to minimize latency in AI algorithms, edge computing has experienced remarkable progress. Decision-making AI applications stand out for their heavy reliance on data-centric operations, predominantl ...

EPFL2024

The 2024 Magnonics Roadmap

Dirk Grundler, Thomas Yu, Ping Che, Qi Wang

Magnonics is a research field that has gained an increasing interest in both the fundamental and applied sciences in recent years. This field aims to explore and functionalize collective spin excitations in magnetically ordered materials for modern informa ...

2024

3D diffractive optics for linear interconnects and nonlinear processing

Niyazi Ulas Dinç

The optical domain presents potential avenues for enhancing both computing and communication due to its inherent properties of bandwidth, parallelism, and energy efficiency. This research focuses on harnessing 3-Dimensional (3D) diffractive optics for nove ...

EPFL2024

Emulating Multimemristive Behavior of Silicon Nanowire-Based Biosensors by Using CMOS-Based Implementations

Kapil Bhardwaj, Sandro Carrara, Junrui Chen

The research presented in this article draws inspiration from previous efforts aimed at replicating the functions of various solid-state memristors using a variety of materials. The memristor circuit emulator serves as a cost-effective tool for circuit des ...

Ieee-Inst Electrical Electronics Engineers Inc2024

Front-End Circuits for Radiation-Hard Monolithic CMOS Sensors targeting High-Energy Physics Applications

Francesco Piro

Monolithic pixel sensors integrate the sensor matrix and readout in the same silicon die, and therefore present several advantages over the more largely used hybrid detectors in high-energy physics. They offer an easier detector assembly, lower cost, lower ...

EPFL2023

Highly Parallel RTL Simulation

Seyedmahyar Emami

Verification and testing of hardware heavily relies on cycle-accurate simulation of RTL. As single-processor performance is growing only slowly, conventional, single-threaded RTL simulation is becoming impractical for increasingly complex chip designs and ...

EPFL2024

Integrated electronics for time-of-flight positron emission tomography photodetectors

Andrada Alexandra Muntean

Positron emission tomography is a nuclear imaging technique well known for its use in oncology for cancer diagnosis and staging. A PET scanner is a complex machine which comprises photodetectors placed in a ring configuration that detect gamma photons gen ...

EPFL2023