Publications associées à A 3D-Printed Functional Mems Accelerometer

Publications associées (17)

An Ultralow-Power Triaxial MEMS Accelerometer With High-Voltage Biasing and Electrostatic Mismatch Compensation

This article presents a triaxial micro electromechani-cal system (MEMS) capacitive accelerometer using a high-voltage biasing technique to achieve high resolution with ultralow power. The accelerometer system generates a differential pair of high voltages ...

Ieee-Inst Electrical Electronics Engineers Inc2024

Amperometric Measurements by a Novel Aerosol Jet Printed Flexible Sensor for Wearable Applications

Sandro Carrara, Sarah Tonello

the last years, increasing interest has been addressed on wearable devices for the continuous monitoring of biochemical profiles of patients and athletes. Among various markers, lactate represents one of the most interesting to deepen the knowledge on fati ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Front-End Circuits for Radiation-Hard Monolithic CMOS Sensors targeting High-Energy Physics Applications

Francesco Piro

Monolithic pixel sensors integrate the sensor matrix and readout in the same silicon die, and therefore present several advantages over the more largely used hybrid detectors in high-energy physics. They offer an easier detector assembly, lower cost, lower ...

EPFL2023

Micro 3D printing of a functional MEMS accelerometer

Luis Guillermo Villanueva Torrijo, Damien Maillard

Microelectromechanical system (MEMS) devices, such as accelerometers, are widely used across industries, including the automotive, consumer electronics, and medical industries. MEMS are efficiently produced at very high volumes using large-scale semiconduc ...

SPRINGERNATURE2022

A new versatile hybrid MEMS technology for high sensitivity, fluid proof sensing applications

Matthias Neuenschwander

The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been dri ...

EPFL2022

Integration of MEMS in Silicon Photonics

Alain Yuji Takabayashi

Like integrated electronics, integrated photonics such as Silicon Photonics benefit from increased device-density on a single chip. Silicon is an excellent material for integrated photonics because its high refractive index allows devices to be made small, ...

EPFL2021

Broadband Compact Single-Pole Double-Throw Silicon Photonic MEMS Switch

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari

Photonic Integrated Circuits (PICs) benefit from the technology advances in the semiconductor industry to incorporate an ever-increasing number of photonic components on a single chip to create large-scale photonic integrated circuits. We here present a br ...

Institute of Electrical and Electronics Engineers2021

Monolithic Fabrication of Silicon Nanowires Bridging Thick Silicon Structures

Yusuf Leblebici, Davide Sacchetto, Oliver Peric, Zuhal Tasdemir

A monolithic process is developed for the fabrication of Si nanowires within thick Si substrates. A combination of anisotropic etch and sidewall passivation is utilized to protect and release Si lines during the subsequent deep etch. An etch depth of 10 mu ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2018

Nano-electromechanical systems based on ultra-thin semiconductors

Sajedeh Manzeli

Nowadays, the interest in 2D materials has gone far beyond graphene. Specially, monolayers of transition metal dichalcogenides (TMDs) offer a broad spectrum of electronic and optical properties, and show the potential to revolutionize the electronics indus ...

EPFL2018

Stereolithography-Based Antennas for Satellite Communications in Ka-Band

Juan Ramon Mosig, Tomislav Debogovic, Maria Garcia Vigueras, Joana Rita Alves dos Santos Silva

This paper illustrates the role of additive manufacturing (AM) as enabling technology to realize high-performance low-cost antennas for Ka-band applications. In addition to the inherent electromagnetic challenges implicit in the conception of such complex ...

Ieee-Inst Electrical Electronics Engineers Inc2017

Microfluidic Scintillation Detectors for High Energy Physics

Pietro Maoddi

This thesis deals with the development and study of microfluidic scintillation detectors, a technology of recent introduction for the detection of high energy particles. Most of the interest for such devices comes from the use of a liquid scintillator, whi ...

EPFL2015

In-plane fabrication of insulated gold-tip probes for electrochemical and force spectroscopy molecular experiments

Nico de Rooij, Terunobu Akiyama, Peter Van der Wal, Sebastian Gautsch, Yexian Wu

A new and versatile fabrication process of insulated gold tip probes for atomic force microscopy (AFM) is presented by Wu et al. (In-plane fabricated insulated gold-tip probe for electrochemical and molecular experiments, in: 2013 IEEE 26th International C ...

Elsevier2014

Encapsulated Low Frequency Vibrating Body Field Effect Resonator

Marion Hermersdorf

Resonators for time and frequency reference applications are essential elements found in most electronic devices surrounding us. The continuous minimization and ubiquitous distribution of such electronic devices and circuits demands for resonators of small ...

EPFL2013

3D structuration of LTCC and related technologies for thermal management and microfluidic structures

Thomas Maeder, Peter Ryser, Caroline Marguerite Jacq, Bo Jiang, Conor Joseph Slater, Fabrizio Vecchio

Ceramic technologies such as LTCC (Low Temperature Co-fired Ceramic) and thick-film are used widely in electronic circuits exposed to harsh environments, for applications in fields such as aerospace, automotive and energy exploration, where, owing to their ...

Soc Microelectronics, Electron Components Materials-Midem2012

All-stencil transistor fabrication on 3D silicon substrates

Jürgen Brugger, Luis Guillermo Villanueva Torrijo, Andreea Veronica Savu, Oscar Vazquez Mena, Peter Vettiger, Katrin Sidler Arnet, Cyrille Hibert, Cristina Martin Olmos, Philippe Langlet

The standard lithographic techniques to fabricate electronic components involve the use of polymers, baking steps and chemicals. This typically restricts their application to flat substrates made up of standard materials. Stencil lithography has been propo ...

Iop Publishing Ltd2012

Sensorless Position Control of Piezoelectric Ultrasonic Motors : a Mechatronic Design Approach

Markus Flückiger

This dissertation considers mechatronic systems driven by piezoelectric ultrasonic motors (PUM). The focus is set on optimal system design and sensorless position control. Mechatronic industry faces the challenge to deliver ever more efficient and reliable ...

EPFL2010

Capacités variables et inductances MEMS RF pour une intégration "Above-IC"

Alexander Mehdaoui

This work was carried out in a collaborative framework between Ecole Polytechnique Fédérale de Lausanne and an industrial partner ST Microelectronics. RF MEMS passives are key devices for the RF front-end in modern transceiver and receiver architectures, o ...

EPFL2007