Publications associées à Low-power hermetically sealed on-chip plasma light source micromachined in glass

Publications associées (14)

Integrated modelling of neon impact on JET H-mode core plasmas

Nuclear fusion reactor plasmas will need to exhaust a significant proportion of energy flux through radiative processes, to enable acceptable divertor loads. This can be obtained by line radiation from impurities, injected from the plasma edge. There are h ...

IOP Publishing Ltd2023

Fabrication and applications of AuAg alloy metasurfaces and hybrid metal dielectric nanoantennas

Debdatta Ray

The most prevalent materials used in the field of plasmonics are Au and Ag. However, for the past few years, the plasmonic community has also been looking for alternative materials that have lower losses than Au and higher stability than Ag. This thesis is ...

EPFL2021

Shining Diamond: from Micro- and Nano-Engineering to Quantum Photonics

Sichen Mi

The discovery of room-temperature single photon emission from color centers in diamond has in recent years boosted research interest in this renowned material in photonics and quantum community and beyond. Following understanding some basic principles of h ...

EPFL2021

Erosion, screening, and migration of tungsten in the JET divertor

Olivier Sauter, Basil Duval, Richard Pitts, Ambrogio Fasoli, Stefano Coda, Henri Weisen, Yves Martin, Yann Camenen, Jan Horacek, Javier García Hernández, Duccio Testa, Marco Wischmeier, Nicola Vianello, Mikhail Maslov, Patrick Blanchard, Alessandro Pau, Davide Galassi, Antonio José Pereira de Figueiredo, Liang Yao, Dalziel Joseph Wilson, Cristian Sommariva, Jonathan Graves, Federico Nespoli, Hamish William Patten, Samuel Lanthaler, David Pfefferlé, Jonathan Marc Philippe Faustin

The erosion of tungsten (W), induced by the bombardment of plasma and impurity particles, determines the lifetime of plasma-facing components as well as impacting on plasma performance by the influx of W into the confined region. The screening of W by the ...

IOP Publishing Ltd2019

A Deep Etching Mechanism for Trench-Bridging Silicon Nanowires

Yusuf Leblebici, Zuhal Tasdemir

Introducing a single silicon nanowire with a known orientation and dimensions to a specific layout location constitutes a major challenge. The challenge becomes even more formidable, if one chooses to realize the task in a monolithic fashion with an extrem ...

Institute of Physics2016

Fabrication defects and grating couplers in III-nitride photonic crystal nanobeam lasers (Conference Presentation)

Nicolas Grandjean, Jean-François Carlin, Raphaël Butté, Ian Michael Rousseau

We report a numerical and experimental investigation of fabrication tolerances and outcoupling in optically pumped III-nitride nanolasers operating near lambda = 460 nm, in which feedback is provided by a one-dimensional photonic crystal nanobeam cavity an ...

Spie-Int Soc Optical Engineering2016

Post-cmos processing and 3d integration based on dry-film lithography

Yusuf Leblebici, Carlotta Guiducci, Yüksel Temiz

A method for performing a post processing pattern on a diced chip having a foot-print, comprises the steps of providing a support wafer; applying a first dry film photoresist to the support wafer; positioning a mask corresponding to the footprint of the di ...

2015

In-Plane Fabricated Insulated Gold-Tip Probe For Electrochemical And Molecular Experiments

Nico de Rooij, Terunobu Akiyama, Peter Van der Wal, Sebastian Gautsch, Yexian Wu

In this contribution we present a scanning probe with a gold-tip completely encapsulated with insulator all the way to the apex. The probe fabrication is unique owing to an in-plane arrangement in which the width of the cantilever is defined by deep reacti ...

IEEE2013

Memristive-Biosensors: A New Detection Method by Using Nanofabricated Memristors

Giovanni De Micheli, Yusuf Leblebici, Sandro Carrara, Davide Sacchetto, Camilla Baj-Rossi

This paper proposes a new detection methodology based on memristive-effect registered on silicon nanowire. The nano-wires are fabricated by a lithographic technique that allows precise and selective etching at the nanoscale. The wires are obtained in three ...

Elsevier2012

SiN membranes with submicrometer hole arrays patterned by wafer-scale nanosphere lithography

Jürgen Brugger, Andreea Veronica Savu, Oscar Vazquez Mena

In this work, nanosphere lithography was integrated with standard microfabrication for the wafer-scale fabrication of silicon nitride (SiN) membranes with arrays of submicrometer holes. A monolayer of polystyrene (PS) beads with a mean diameter of 428 or 5 ...

2011

Wafer-Scale Fabrication of Thin SiN Membranes and Au Films and Membranes with Arrays of Sub-um Holes Using Nanosphere Lithography

In this thesis, the wafer-scale fabrication of SiN membranes, Au films and Au membranes with arrays of sub-µm holes is described. Two conceptually different processes (1) and (2) were developed, both of which are based on nanosphere lithography (NSL) with ...

EPFL2010

Low-power hermetically sealed on-chip plasma light source micromachined in glass

Philippe Renaud, Herbert Shea

We report on the fabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity in which electrodes are used to ignite a low power (≪500 mW ...

2008

Dry etching for the correction of gap-induced blurring and improved pattern resolution in nanostencil lithography

Jürgen Brugger, Marc Antonius Friedrich van den Boogaart

We present nanostencil lithography as a new and parallel nanopatterning technique for batch fabrication of micro/ nanoelectromechanical systems (MEMS/NEMS) with high throughput and resolution. We use nanostencil lithography for the purpose of integrating n ...

2007

Développement et étude d'une technique de microsablage à haute résolution

Anne-Gabrielle Pawlowski

We have used powder blasting as a technique to structure brittle materials like glass using an erosion resistant mask. The study of the erosion rate shows that the erosion of glass is maximum at a normal incidence of the powder beam while the erosion rate ...

EPFL2006