Publications associées à SiN membranes with submicrometer hole arrays patterned by wafer-scale nanosphere lithography

Publications associées (34)

Low-noise, frequency-agile photonic integrated lasers

Photonic integrated circuits (PICs) have revolutionized optical communication and precision metrology by enabling compact, scalable, and high-performance optical systems. However, conventional integrated laser sources suffer from limitations such as poor c ...

EPFL2025

Ultraviolet to mid-infrared optical properties of sputtered Al(Sc)N-on-SiO2 thin films and experimental demonstration of AlN integrated photonic devices in the telecom C-band

Luis Guillermo Villanueva Torrijo, Hernán Furci

Thin film aluminum nitride (AlN) stands out as a promising material for integrated photonics due to its wide bandgap of 6.1 eV, facilitating efficient operation across diverse spectral ranges. Its inherent electro-optic and nonlinear optical properties mak ...

2024

Silicon nitride electric-field poled microresonator modulator

Camille Sophie Brès, Edgars Nitiss, Boris Zabelich, Anton Stroganov, Christian André Clément Lafforgue

Stoichiometric silicon nitride is a highly regarded platform for its favorable attributes, such as low propagation loss and compatibility with complementary metal-oxide-semiconductor technology, making it a prominent choice for various linear and nonlinear ...

2024

Integrated chirped photonic-crystal cavities in gallium phosphide for broadband soliton generation

Tobias Kippenberg, Johann Emmeram Riemensberger, Miles Henry Anderson, Nikolai Kuznetsov, Alisa Davydova

Chirped mirrors have underpinned advances in ultra-fast lasers based on bulk optics but have yet to be fully exploited in integrated photonics, where they could provide a means to engineer otherwise unattainable dispersion profiles for a range of nonlinear ...

2024

Foundry compatible, efficient wafer-scale manufacturing of ultra-low loss, high-density Si3N4 photonic integrated circuits

Tobias Kippenberg, Rui Ning Wang, Johann Emmeram Riemensberger, Zheru Qiu, Xinru Ji

We demonstrate ultra-low propagation loss, lithographic precision, and wafer-scale manufacturing for high-density Si3N4 photonic integrated circuits using an efficient DUV-based subtractive approach. We show a propagation loss as low as 1.4 dB/m at 1.55 µm ...

Optical Society of America2024

Parametric Wavelength Conversion in Waveguiding Structures: Efficiency, Bandwidth and Polarization

Arman Ayan

Photonics integrated circuits are a promising solution for the growing demands of data transmission and future system-on-chip technologies. Within this context, nonlinear optical interactions offer unique opportunities for all-optical processing, sampling, ...

EPFL2024

High density lithium niobate photonic integrated circuits

Tobias Kippenberg, Rui Ning Wang, Johann Emmeram Riemensberger, Anat Siddharth, Mikhail Churaev, Nikolai Kuznetsov, Zihan Li, Junyin Zhang, Zelin Tan

Photonic integrated circuits have the potential to pervade into multiple applications traditionally limited to bulk optics. Of particular interest for new applications are ferroelectrics such as Lithium Niobate, which exhibit a large Pockels effect, but ar ...

Nature Portfolio2023

Stencil-Based Selective Surface Functionalization of Silicon Nanowires in 3D Device Architectures for Next-Generation Biochemical Sensors

Yusuf Leblebici

Surface functionalization of 1D materials such as silicon nanowires is a critical preparation technology for biochemical sensing. However, existing nonselective functionalization techniques result in nonlocal binding and contamination, with potential devic ...

Amer Chemical Soc2024

A heterogeneously integrated lithium niobate-on-silicon nitride photonic platform

Tobias Kippenberg, Junqiu Liu, Rui Ning Wang, Johann Emmeram Riemensberger, Anat Siddharth, Mikhail Churaev, Miles Henry Anderson, Viacheslav Snigirev, Terence Albert Emile Blésin

The availability of thin-film lithiumniobate on insulator (LNOI) and advances in processing have led to the emergence of fully integrated LiNbO3 electro-optic devices. Yet to date, LiNbO3 photonic integrated circuits have mostly been fabricated using non-s ...

Nature Portfolio2023

Photothermal spectroscopy on-chip sensor for the measurement of a PMMA film using a silicon nitride micro-ring resonator and an external cavity quantum cascade laser

Simone Iadanza

Laser-based mid-infrared (mid-IR) photothermal spectroscopy (PTS) represents a selective, fast, and sensitive analytical technique. Recent developments in laser design permits the coverage of wider spectral regions in combination with higher power, enablin ...

Walter De Gruyter Gmbh2024

Low-loss and high-index contrast ultraviolet-C free-standing waveguides made of thermal silicon oxide

Christophe Marcel Georges Galland, Claudio Alejandro Jaramillo Concha

Photonics in the ultraviolet provides an avenue for key advances in biosensing, pharmaceutical research, and environmental sensing. However, despite recent progress in photonic integration, a technological solution to fabricate photonic integrated circuits ...

2024

Towards Scalable Electronics: Synthetic 2D Materials for Large-Area 2D Circuit Integration

Zhenyu Wang

In the past decades, a significant increase of the transistor density on a chip has led to exponential growth in computational power driven by Moore's law. To overcome the bottleneck of traditional von-Neumann architecture in computational efficiency, effo ...

EPFL2024

Programmable Silicon Nitride Photonic Integrated Circuits

Tobias Kippenberg, Johann Emmeram Riemensberger, Rui Ning Wang, Anat Siddharth, Andrey Voloshin, Viacheslav Snigirev, Andrea Bancora, Vladimir Shadymov

Silicon Nitride (Si3N4) photonic integrated circuits (PICs) have emerged as core technology in a variety of applications ranging from LIDAR to quantum control and computing. However, the need for high-speed, low-voltage tuning and modulation has been a lon ...

IEEE2023

Microstructural and electrical characterization of high temperature passivating contacts for silicon solar cells

Sofia Libraro

Recombination at metal/semiconductor interfaces represents the main limitation in mainstream c-Si solar cells, primarily based on the passivated emitter and rear cell (PERC) concept. Full-area passivating contacts based on SiOx/poly-Si stacks are a candida ...

EPFL2024

Additive and digital manufacturing of transient sensors and bioelectronics

Nicolas Francis Fumeaux

Transient electronics have emerged as a promising class of devices, capable of breaking down without harmful side effects to their environment. They have tremendous potential as bioresorbable electronics for temporary applications in the human body, and as ...

EPFL2023

Laser-Induced Forward Transfer of Functional Microdevices

Zhiwei Yang

Laser-induced forward transfer (LIFT) technique is an emerging micro additive manufacturing (AM) technique that has been widely used to print a variety of materials. Distinguished from other nozzle-based AM techniques, LIFT operates without the existence o ...

EPFL2023

Lithium tantalate photonic integrated circuits for volume manufacturing

Tobias Kippenberg, Johann Emmeram Riemensberger, Mikhail Churaev, Xinru Ji, Zihan Li, Terence Albert Emile Blésin, Chengli Wang, Junyin Zhang, Xi Wang, Chen Yang, Wil Kao, Alisa Davydova

Electro-optical photonic integrated circuits (PICs) based on lithium niobate (LiNbO3) have demonstrated the vast capabilities of materials with a high Pockels coefficient1,2. They enable linear and high-speed modulators operating at complementary metal–oxi ...

2024

Piezoelectric actuation for integrated photonics

Tobias Kippenberg, Rui Ning Wang, Johann Emmeram Riemensberger, Anat Siddharth, Andrey Voloshin, Viacheslav Snigirev, Terence Albert Emile Blésin, Andrea Bancora, Vladimir Shadymov

Recent decades have seen significant advancements in integrated photonics, driven by improvements in nanofabrication technology. This field has been developed from integrated semiconductor lasers and low-loss waveguides to optical modulators, enabling the ...

Optica Publishing Group2024

The rise of aerial additive manufacturing in construction: a review of material advancements

Mirko Kovac, Yusuf Furkan Kaya

The construction industry has recently increased the adoption of additive manufacturing (AM, also known as 3D-printing) technologies. This review paper presents the state of the art of ground-based AM systems in construction, focusing comprehensively on de ...

2024

Zinc hybrid sintering for printed transient sensors and wireless electronics

Danick Briand, Nicolas Francis Fumeaux

Transient electronics offer a promising solution for reducing electronic waste and for use in implantable bioelectronics, yet their fabrication remains challenging. We report on a scalable method that synergistically combines chemical and photonic mechanis ...

2023