Remco Franciscus Peter van Erp

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The integration of diamond and GaN has been highly pursued for thermal management purposes as well as combining their exceptional complementary properties for power electronics applications and novel semiconductor heterostructures. However, the growth of d ...

In this work, we demonstrate a new thermal management approach for direct cooling of GaN-on-Si power integrated circuits (ICs), in which the Si substrate functions as a microfluidic heat sink, turning Si into a cost-effective, high thermal performance subs ...

In this paper, a high step-up magnetic-less DC/DC nX converter is designed and experimentally evaluated. GaN transistors are applied in a nX converter topology, yielding ultrahigh power density and high conversion efficiency. The absence of magnetic materi ...

In this paper, a module-level photovoltaic (PV) architecture in parallel configuration is introduced for maximum power extraction, under partial shading (PS) conditions. For the first time, a non-regulated switched capacitor (SC) nX converter is a used at ...

The important distinction between stored energy and co-energy components of the output capacitance of field-effect transistors (FETs) is not explicitly discussed in the literature, and hence, less understood in relation to the switching losses in power ele ...

In this paper, we review some of the main methods to characterize on-state and off-state losses in wide-band-gap devices under switching conditions. In the off-state, we will discuss about losses related to charging and discharging the output capacitance i ...

In this work, we describe a new approach for compact and energy-efficient cooling of converters where multiple miniaturized microfluidic cold-plates are attached to transistors providing local heat extraction. The high pressure drop associated with microch ...

AlGaN/GaN devices have shown outstanding potential for power conversion applications. However, despite the recent progress, their performance is still far from what the material can offer in terms of on-resistance and breakdown voltage. To address this cha ...

In many semiconductor technologies, including GaN, the lack of p-channel devices is a major obstacle for complementary operations. Here, we demonstrate high-performance polycrystalline diamond p-channel transistors on GaN-on-Si. Following the optimization ...

Wide-band-gap technologies enable ultra-high efficiencies in high-frequency power conversion. However, inadequate accuracies in electrical measurements could lead to spurious efficiency measurements, even above 100%. Furthermore, bandwidth limitations, par ...

This work presents a mixed simulation experimental method for efficiency optimization of a modular multilevel switched capacitor DC-DC converter. The results show that the optimal frequency deviates from the circuit's self-resonant frequency, commonly prop ...

With reducing transistor sizes and increasing levels of integration, extracting the heat from electronic devices is an ongoing challenge. Conventional indirect-cooling approaches are hindered by thermal interfaces, as well as heat spreading to larger areas ...

Efficient and compact power conversion is a key requirement to achieve sustainable electrification of our society. GaN-based power devices offer major benefits compared to their silicon counterparts in terms of efficiency and integration but suffer from se ...

Plasma formation in micro- and nano-scales enables an ultrahigh-dv/dt picosecond switching in an integrated circuit form factor. Such on-chip plasma devices could provide a transformative approach to achieving high-power levels at very high frequencies, fa ...

Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

Increase in heat fluxes as a result of the miniaturization of power electronics demands new thermal management solutions such as liquid cooling, because of its high heat extraction capabilities. This work describes a new silicon-based heat sink that takes ...

Thermal management is one of the main challenges for the future of electronics1,2,3,4,5. With the ever-increasing rate of data generation and communication, as well as the constant push to reduce the size and costs of industrial converter systems, the powe ...

Many high power (opto-) electronic devices such as transistors, diodes, and lasers suffer from significant hot spot temperature rises due to the high heat fluxes generated in their active area, which limits their performance, reliability, and lifetime. Emp ...

The difficulty in accurately measuring losses in high-frequency power converters hinders accurate breakdown of losses which is essential for device and circuit optimization. Electrical methods are often not adequate and calorimetric approaches found in the ...

Wide-Band-Gap semiconductors have enabled considerable miniaturization of power devices, which requires, however, new thermal management solutions to handle the resulting high heat fluxes. Recently, embedded liquid cooling in GaN-on-Si devices was demonstr ...

Remco Franciscus Peter van Erp

Chattez avec Graph Search

Seed Dibbling Method for the Grow of High-Quality Diamond on GaN

Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits

Ultra-High Power Density Magnetic-less DC/DC Converter Utilizing GaN Transistors

Parallel PV Configuration with Magnetic-Free Switched Capacitor Module-Level Converters for Partial Shading Conditions

Analysis of Output Capacitance Co-Energy and Discharge Losses in Hard-Switched FETs

Switching losses in power devices: From dynamic on resistance to output capacitance hysteresis

Efficient Microchannel Cooling of Multiple Power Devices with Compact Flow Distribution for High Power-Density Converters

High-Performance Enhancement-Mode AlGaN/GaN Multi-Channel Power Transistors

H-terminated polycrystalline diamond p-channel transistors on GaN-on-Silicon

High-Accuracy Calibration-Free Calorimeter for the Measurement of Low Power Losses

Mixed Simulation-Experimental Optimization of a Modular Multilevel Switched Capacitors Converter Cell

Bringing the Heat Sink Closer to the Heat: Evaluating Die-embedded Microchannel Cooling of GaN-on-Si Power Devices

Embedded Microchannel Cooling for Monolithically-integrated GaN Half-bridge ICs

Kilowatt-range Picosecond Switching Based on Microplasma Devices

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

A manifold microchannel heat sink for ultra-high power density liquid-cooled converters

Co-designing electronics with microfluidics for more sustainable cooling

Near-junction heat spreaders for hot spot thermal management of high power density electronic devices

Microchannel-based Calorimeter for Rapid and Accurate Loss Measurements on High-efficiency Power Converters

Impact of Embedded Liquid Cooling on the Electrical Characteristics of GaN-on-Si Power Transistors