Mohamed Mostafa Sabry Aly

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The soaring demand for computing power in our digital information age has produced as collateral undesirable effect a surge in power consumption and heat density for computing servers. Accordingly, 30-40% of the energy consumed in state-of-the-art servers ...

Today there is a growing interest in the integration of health monitoring applications in portable devices necessitating the development of methods that improve the energy efficiency of such systems. In this paper, we present a systematic approach that ena ...

3-Dimensional integrated circuits and systems are expected to be present in electronic products in the short term. We consider specifically 3-D multi-processor systems-onchip (MPSoCs), realized by stacking silicon CMOS chips and interconnecting them by mea ...

3D stacked systems reduce communication delay in multiprocessor system-on-chips (MPSoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates temperatureinduced problems such ...

Time lag and quantization in temperature sensors in enterprise servers lead to stability concerns on existing variable fan speed control schemes. Stability challenges become further aggravated when multiple local controllers are running together with the f ...

While possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchannel liquid cooling of 3D ICs also creates the problem of increased thermal gradients from the fluid inlet to outlet ports [1, 2]. These cooling-induced therma ...

The development of compiler-based mechanisms to optimize the thermal profile of large register files to improve the processor reliability has become an important issue. Thermal hotspots have been known to cause severe reliability issues, while the thermal ...

3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates the reliability and thermal problems, a ...

Recent process technology advances trigger reliability issues that degrade the Quality-of-Service (QoS) required by embedded Systems-on-Chip (SoCs). To maintain the required QoS with acceptable overheads, we propose OCEAN, a novel cross-layer error mitigat ...

On-chip memory organization is one of the most important aspects that can influence the overall system behavior in multi-processor systems. Following the trend set by high-performance processors, high-end embedded cores are moving from single-level on chip ...

Three-dimensional (3D) stacking is an attractive method for designing large manycore chips as it provides high transistor integration densities, improves manufacturing yield due to smaller chip area, reduces wirelength and capacitance, and enables heteroge ...

Vertically-integrated 3D multiprocessors systems-on-chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime performance. However, 3D MPSoCs incur amplified thermal ch ...

Integrated Flow-Cell Arrays (FCAs) represent a combination of integrated liquid cooling and on-chip power generation, converting chemical energy of the flowing electrolyte solutions to electrical energy. The FCA technology provides a promising way to addre ...

In this paper we investigate the impact of potential hardware misbehavior induced by reliability issues and scaled voltages in wireless body sensor network (WBSN) nodes. Our study reveals the inherent resilience of popular algorithms in cardiac monitoring ...

This paper focuses on a review of state-of-the-art memory designs and new design methods for near-threshold computing (NTC). In particular, it presents new ways to design reliable low-voltage NTC memories cost-effectively by reusing available cell librarie ...

Wireless body sensor nodes (WBSNs) are miniaturized devices that are able to acquire, process and transmit bio-signals (such as electrocardiograms, respiration or human-body kinetics). WBSNs face major design challenges due to extremely limited power budge ...

Mohamed Mostafa Sabry Aly

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Integrated Microfluidic Power Generation and Cooling for Bright Silicon MPSoCs

A Quality-Scalable and Energy-Efficient Approach for Spectral Analysis of Heart Rate Variability

Hierarchical Thermal Management Policy for High-Performance 3D Systems with Liquid Cooling

Energy-Efficient Multi-Objective Thermal Control for Liquid-Cooled 3D Stacked Architectures

Global Fan Speed Control Considering Non-Ideal Temperature Measurements in Enterprise Servers

A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs

Thermal-Aware Compilation for Register Window-Based Embedded Processors

Fuzzy Control for Enforcing Energy Efficiency in High-Performance 3D Systems

OCEAN: An Optimized HW/SW Reliability Mitigation Approach for Scratchpad Memories in Real-Time SoCs

Performance and Energy Trade-offs Analysis of L2 on-Chip Cache Architectures for Embedded MPSoCs

Attaining Single-Chip, High-Performance Computing Through 3D Systems with Active Cooling

Temperature-Aware Design and Management for 3D Multi-Core Architectures

PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays

Design of Energy Efficient and Dependable Health Monitoring Systems under Unreliable Nanometer Technologies

Multi-level Optimization Methodologies for Thermally Reliable Multi-Core Architectures

Resolving the Memory Bottleneck for Single Supply Near-Threshold Computing

Nano-Engineered Architectures for Ultra-Low Power Wireless Body Sensor Nodes