David Atienza Alonso

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The soaring demand for computing power in our digital information age has produced as collateral undesirable effect a surge in power consumption and heat density for computing servers. Accordingly, 30-40% of the energy consumed in state-of-the-art servers ...

The multicore revolution and the ever-increasing complexity of computing systems is dramatically changing system design, analysis and programming of computing platforms. Future architectures will feature hundreds to thousands of simple processors and on-ch ...

The Core Cosmology Library (CCL) provides routines to compute basic cosmological observables to a high degree of accuracy, which have been verified with an extensive suite of validation tests. Predictions are provided for many cosmological quantities, incl ...

The development of embedded and interlayer liquid cooling in integrated circuits (ICs) using silicon microchannels has gained interest in the recent years owing to the rise of on-chip heat uses that aggravate thermal reliability issues of the emerging 3D s ...

Real-time video transcoding has recently raised as a valid alternative to address the ever-increasing demand for video contents in servers' infrastructures in current multi-user environments. High Efficiency Video Coding (HEVC) makes efficient online trans ...

Modern datacenters need to tackle efficiently the increasing demand for computing resources while minimizing energy usage and monetary costs. Power market operators have recently introduced emerging demand-response programs, in which electricity consumers ...

The performance and the efficiency of recent computing platforms have been deeply influenced by the widespread adoption of hardware accelerators, such as Graphics Processing Units (GPUs) or Field Programmable Gate Arrays (FPGAs), which are often employed t ...

Today there is a growing interest in the integration of health monitoring applications in portable devices necessitating the development of methods that improve the energy efficiency of such systems. In this paper, we present a systematic approach that ena ...

The advent of 3D stacked ICs with accumulating heat fluxes stresses thermal reliability and is responsible for temperature driven performance deterioration of the electronic systems Hot spots with power densities typically rising up to 250 W/cm2 are not ac ...

3-Dimensional integrated circuits and systems are expected to be present in electronic products in the short term. We consider specifically 3-D multi-processor systems-onchip (MPSoCs), realized by stacking silicon CMOS chips and interconnecting them by mea ...

Deeply-scaled three-dimensional (3D) Multi-Processor Systems-on-Chip (MPSoCs) enable high performance and massive communication bandwidth for next-generation computing. However, as process nodes shrink, temperature-dependent leakage dramatically increases, ...

Compute memories are memory arrays augmented with dedicated logic to support arithmetic. They support the efficient execution of data-centric computing patterns, such as those characterizing Artificial Intelligence (AI) algorithms. These architectures can ...

Modern high-performance processors employ thermal management systems, which rely on accurate readings of on-die thermal sensors. Systematic tools for analysis and determination of best allocation and placement of thermal sensors is therefore a highly relev ...

Server consolidation plays a key role to mitigate the continuous power increase of datacenters. The recent advent of scale-out applications (e.g., web search, MapReduce, etc.) necessitate the revisit of existing server consolidation solutions due to distin ...

Liquid-cooling using microchannel heat sinks etched on silicon dies is seen as a promising solution to the rising heat fluxes in two-dimensional and stacked three-dimensional integrated circuits. Development of such devices requires accurate and fast therm ...

With technological advances, the number of cores integrated on a chip is increasing. This, in turn is leading to thermal constraints and thermal design challenges. Temperature gradients and hot-spots not only affect the performance of the system, but also ...

Background and Objective: Cardiovascular diseases, a leading cause of noncommunicable disease-related deaths, require early and accurate detection to improve patient outcomes. Taking advantage of advances in machine learning and deep learning, multiple app ...

New tendencies envisage 2D and 3D Multi-Processor Systems-On-Chip (MPSoCs) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute multiple applications (games, video), while meeting additional design ...

The Horizon 2020 MANGO project aims at exploring deeply heterogeneous accelerators for use in High Performance Computing systems running multiple applications with different Quality of Service (QoS) levels. The main goal of the project is to exploit custom ...

To reduce energy consumption, it is possible to operate embedded systems at sub-nominal conditions (e.g., reduced voltage, limited eDRAM refresh rate) that can introduce bit errors in their memories. These errors can affect the stored values of CNN weights ...

David Atienza Alonso

Chattez avec Graph Search

Integrated Microfluidic Power Generation and Cooling for Bright Silicon MPSoCs

GPGPU-Accelerated Parallel and Fast Simulation of Thousand-core Platforms

Core Cosmology Library: Precision Cosmological Predictions for LSST

A semi-analytical approach for optimized design of microchannel liquid-cooled ICs

MAMUT: Multi-Agent Reinforcement Learning for Efficient Real-Time Multi-User Video Transcoding

ECOGreen: Electricity Cost Optimization for Green Datacenters in Emerging Power Markets

Parallelizing the Chambolle Algorithm for Performance Optimized Mapping on FPGA devices

A Quality-Scalable and Energy-Efficient Approach for Spectral Analysis of Heart Rate Variability

Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries

Hierarchical Thermal Management Policy for High-Performance 3D Systems with Liquid Cooling

Towards Deeply Scaled 3D MPSoCs with Integrated Flow Cell Array Technology

Overflow-free compute memories for edge AI acceleration

A Combined Sensor Placement and Convex Optimization Approach for Thermal Management in 3D-MPSoC with Liquid Cooling

Correlation-Aware Virtual Machine Allocation for Energy-Efficient Datacenters

3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

Online Thermal Control Methods for Multi-Processor Systems

FADE: Forecasting for anomaly detection on ECG

Emulation-Based Transient Thermal Modeling of 2D/3D Systems-on-Chip with Active Cooling

Exploring manycore architectures for next-generation HPC systems through the MANGO approach

E2CNN: Ensembles of Convolutional Neural Networks to Improve Robustness Against Memory Errors in Edge-Computing Devices