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Concept

Multi-project wafer service

Publications associées (33)

Silicon photonic microelectromechanical phase shifters for scalable programmable photonics

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari

Programmable photonic integrated circuits are emerging as an attractive platform for applications such as quantum information processing and artificial neural networks. However, current programmable circuits are limited in scalability by the lack of low-po ...

OPTICAL SOC AMER2021

Advanced Progress on chi((3)) Nonlinearity in Chip-Scale Photonic Platforms

Jijun He, Feng Li

chi((3)) nonlinearity enables ultrafast femtosecond scale light-to-light coupling and manipulation of intensity, phase, and frequency. chi((3)) nonlinear functionality in micro- and nanoscale photonic waveguides can potentially replace bulky fiber platform ...

The Electromagnetic Academy2021

Cryogenic Characterization of 16 nm FinFET Technology for Quantum Computing

Edoardo Charbon, Christian Enz, Farzan Jazaeri, Hung-Chi Han, Antonio D'Amico

This study presents the first in depth characterization of deep cryogenic electrical behavior of a commercial 16 nm CMOS FinFET technology. This technology is well suited for a broad range of applications, including quantum computing, quantum sensing, and ...

IEEE2021

MORPHIC: Programmable photonic circuits enabled by silicon photonic MEMS

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari, Banafsheh Abasahl

In the European project MORPHIC we develop a platform for programmable silicon photonic circuits enabled by waveguide-integrated micro-electro-mechanical systems (MEMS). MEMS can add compact, and low-power phase shifters and couplers to an established sili ...

SPIE-INT SOC OPTICAL ENGINEERING2020

MEMS-Enabled Silicon Photonic Integrated Devices and Circuits

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari, Yu Zhang

Photonic integrated circuits have seen a dramatic increase in complexity over the past decades. This development has been spurred by recent applications in datacenter communications and enabled by the availability of standardized mature technology platform ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2020

Wafer-Scale Fabrication of Nanopore Devices for Single-Molecule DNA Biosensing using MoS2

Aleksandra Radenovic, Andras Kis, Martina Lihter, Michal Daniel Macha, Michael Graf, Andrey Chernev, Mukesh Kumar Tripathi, Mukeshchand Thakur, Jochem Deen

Atomically thin (2D) nanoporous membranes are an excellent platform for a broad scope of academic research. Their thickness and intrinsic ion selectivity (demonstrated for example in molybdenum disulfide-MoS2) make them particularly attractive for single-m ...

2020

Towards Deeply Scaled 3D MPSoCs with Integrated Flow Cell Array Technology

David Atienza Alonso, Marina Zapater Sancho, Alexandre Sébastien Julien Levisse, Mohamed Mostafa Sabry Aly, Halima Najibi

Deeply-scaled three-dimensional (3D) Multi-Processor Systems-on-Chip (MPSoCs) enable high performance and massive communication bandwidth for next-generation computing. However, as process nodes shrink, temperature-dependent leakage dramatically increases, ...

2020

Wafer-scale fabrication of ultralow-loss silicon nitride nonlinear photonic circuits

Tobias Kippenberg, Junqiu Liu, Maxim Karpov, Rui Ning Wang, Jijun He, Wenle Weng, Arslan Sajid Raja, Guanhao Huang, Miles Henry Anderson, Anton Lukashchuk, Nils Johan Engelsen, Anat Siddharth, Mikhail Churaev, Alexey Tikan

Recent advances in silicon nitride integrated photonics have achieved ultralow optical losses. Transferring this technology to standard commercial foundries, and merging it with silicon photonics via heterogeneous integration, will seed novel laser and qua ...

IEEE2020

Monolithically Integrated Catalyst-Free High Aspect Ratio InAs-on-Insulator (InAsOI) FinFETs for pH Sensing

Mihai Adrian Ionescu, Francesco Bellando, Fabien Patrick Wildhaber, Junrui Zhang, Maneesha Rupakula, Clarissa Convertino

In this work, we report a novel Indium Arsenide-on-insulator (InAsOI) FinFET platform designed with record high aspect ratio that favors the use of the devices as charge sensors. InAs has very high mobility among III-V semiconductors and an intrinsic surfa ...

2020

Compact broadband suspended silicon photonic directional coupler

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari, Yu Zhang

Directional couplers are extensively used in photonic integrated circuits as basic components for efficient on-chip photonic signal routing. Conventionally, directional couplers are fully encapsulated in the technology's waveguide cladding material. In thi ...

OPTICAL SOC AMER2020

Stretchable Kirigami Components for Composite Meso-Scale Robots

Jamie Paik, Amir Firouzeh

Layer-by-layer manufacturing of composite mechanisms allows fast and cost-effective fabrication of customized robots in millimeter and centimeter scales which is promising for research fields that rely on frequent and numerous physical iterations. Due to t ...

2020

Monolithically integrated catalyst-free High Aspect Ratio InAs-On-Insulator (InAsOI) FinFETs for pH sensing

Mihai Adrian Ionescu, Kirsten Emilie Moselund, Francesco Bellando, Fabien Patrick Wildhaber, Junrui Zhang, Maneesha Rupakula, Clarissa Convertino

In this work, we report a novel Indium Arsenide-on-insulator (InAsOI) FinFET platform designed with record high aspect ratio that favor the use of the devices as charge sensors. InAs has very high mobility among III-V semiconductors and an intrinsic surfac ...

IEEE2019

Low-Cost Readout Electronics for Piezoresistive MEMS-Based Transducers

Marco Mattavelli, Diego Ruben Barrettino

The designs fabrication and testing of low-cost readout electronics for piezoresistive MEMS-based transducers are presented in this paper. The proposed circuit architecture has a low input referred noise power spectral density of 60nV/root Hz a latency of ...

IEEE2019