Mediaspace scheduled maintenance: Aug 25, 2026 07:00 - 12:00 AM. During this time, videos will be temporarily unavailable. Check status updates.

Concept

Wafer-level packaging

Publications associées (26)

In-plane fabrication of insulated gold-tip probes for electrochemical and force spectroscopy molecular experiments

Nico de Rooij, Terunobu Akiyama, Peter Van der Wal, Sebastian Gautsch, Yexian Wu

A new and versatile fabrication process of insulated gold tip probes for atomic force microscopy (AFM) is presented by Wu et al. (In-plane fabricated insulated gold-tip probe for electrochemical and molecular experiments, in: 2013 IEEE 26th International C ...

Elsevier2014

Top-Down Fabrication of Silicon Nanowires in Ultra-deep Trenches

Yusuf Leblebici, Georg Fantner, Davide Sacchetto, Oliver Peric, Zuhal Tasdemir

One-Dimensional (1D) nanostructures have gained a considerable attention in the field of semiconductor technology for the past several decades. With the help of rapid development in the process technology, it becomes possible to scale these nanostructures ...

2014

Encapsulated Low Frequency Vibrating Body Field Effect Resonator

Marion Hermersdorf

Resonators for time and frequency reference applications are essential elements found in most electronic devices surrounding us. The continuous minimization and ubiquitous distribution of such electronic devices and circuits demands for resonators of small ...

EPFL2013

Integrated packaging solutions and hotplates for a miniature atomic clock and other microsystems

Fabrizio Vecchio

This thesis aimed at developing innovative packaging solutions for a miniature atomic clock and other microsystems in the cm-scale, i.e. somewhat larger than what is practical for full "chip-scale" device-package integration using clean-room technologies f ...

EPFL2013

3D Integration Technology for Lab-on-a-Chip Applications

Yüksel Temiz

This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...

EPFL2012

In-situ grown horizontal carbon nanotube membrane

Mihai Adrian Ionescu, Hoël Maxime Guérin

We present the successful fabrication of horizontally grown and dense carbon nanotube (CNT) membranes in situ. A TiN/Al2O3/TiN stack is first patterned to be employed as a support for the CNT growth. Iron is then evaporated with a 45 degrees tilt angle on ...

Elsevier2012