Publication

Use of scanning capacitance microscopy for controlling wafer processing

Klaus Kern, Harald Brune, Pierre Fazan
2002
Journal Articles

Abstract

Scanning capacitance microscopy and electrostatic force microscopy have been used to characterize commercial semiconductor devices at various stages of the fabrication process. These methods, combined with conventional atomic force microscopy, allow to visualize qualitatively the oxide thickness, the nature of dopants and the exact position of implanted areas. (C) 2002 Elsevier Science Ltd. All rights reserved.

Official source

https://infoscience.epfl.ch/entities/publication/fc1b14ea-1857-49d9-8fbe-068fd16d552d

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Klaus Kern, Harald Brune, Pierre Fazan
2002
Journal Articles

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/fc1b14ea-1857-49d9-8fbe-068fd16d552d

About this result

Related concepts (27)

Transmission electron microscopy

Transmission electron microscopy (TEM) is a microscopy technique in which a beam of electrons is transmitted through a specimen to form an image. The specimen is most often an ultrathin section less than 100 nm thick or a suspension on a grid. An image is formed from the interaction of the electrons with the sample as the beam is transmitted through the specimen. The image is then magnified and focused onto an imaging device, such as a fluorescent screen, a layer of photographic film, or a sensor such as a scintillator attached to a charge-coupled device.

Scanning probe microscopy

Scanning probe microscopy (SPM) is a branch of microscopy that forms images of surfaces using a physical probe that scans the specimen. SPM was founded in 1981, with the invention of the scanning tunneling microscope, an instrument for imaging surfaces at the atomic level. The first successful scanning tunneling microscope experiment was done by Gerd Binnig and Heinrich Rohrer. The key to their success was using a feedback loop to regulate gap distance between the sample and the probe.

Semiconductor device fabrication

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.

Related publications (9)

Use of scanning capacitance microscopy for controlling wafer processing

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