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We demonstrate the integration of a Si3N4 Damascene photonic platform with thin-film lithium niobate on insulator (LNOI) via direct wafer bonding. This process enables fabrication of hybrid chi((2))-chi((3)) microresonators with Q similar to 10(6), as well as integrated travelling wave EO modulators. (c) 2020 The Author(s)
Herbert Shea, Amir Firouzeh, Edouard Franck Vincent Gustave Leroy