Publication

TEM investigation of MoSeC films

Silviu Cosmin Sandu
2008
Journal Articles

Abstract

Transition metal dichalcogenides (TMD) are widely used as self-lubricating material either as oil additive or directly as thin films. Magnetron sputtering is a deposition method allowing depositing such films with high density and adhesion. However, their spread use in practical applications is still hindered since their excellent sliding properties are deteriorated in the presence of humidity and under high contact pressures. MoSe2, one of the members of TMD family recently studied, has been co-sputtered with carbon in order to improve the mechanical and tribological properties when compared to pure MoSe2 films.

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https://infoscience.epfl.ch/entities/publication/edf79295-c410-4dc7-9eb4-4d8a4014d349

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Silviu Cosmin Sandu
2008
Journal Articles

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/edf79295-c410-4dc7-9eb4-4d8a4014d349

About this result

Related concepts (26)

Sputter deposition

Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K).

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Related publications (31)

TEM investigation of MoSeC films

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