Publication

Combinatorial Chemical Vapor Deposition of Lithium Niobate Thin Films

Patrik Willi Hoffmann, Giacomo Benvenuti
2009
Conference Papers

Abstract

Combinatorial lithium niobate deposition on 150 mm naturally oxidized silicon (100) wafers in a high-vacuum chemical vapor deposition reactor using Li(OBut) and Nb(OEt)4(dmae) is presented. The novel precursor supply system allows individual spatial control of precursors impinging rates on the substrate. This results in variations of the film properties in a single experiment at a certain substrate temperature due to the influence of different precursors flow rates and ratios. It efficiently leads to deposition conditions to achieve highly oriented polycrystalline lithium niobate films.

Official source

https://infoscience.epfl.ch/entities/publication/e797f249-b2c3-4aa1-b57c-613da52a8f7e

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Patrik Willi Hoffmann, Giacomo Benvenuti
2009
Conference Papers

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/e797f249-b2c3-4aa1-b57c-613da52a8f7e

About this result

Related concepts (32)

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Atomic layer deposition

Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process; it is a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals called precursors (also called "reactants"). These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. A thin film is slowly deposited through repeated exposure to separate precursors.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

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Combinatorial Chemical Vapor Deposition of Lithium Niobate Thin Films

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