Publication

Powder blasting as a three-dimensional microstructuring technology for MEMS applications

Martinus Adela Maria Gijs, Abdeljalil Sayah
2000
Conference Papers

Abstract

We present powder blasting as a new technology for the realization of Micro Electro-Mechanical Systems (MEMS). The technique is base don the erosion of a masked substrate by a high velocity powder beam. We study the erosion rate of the process using glass wafers and introduce oblique powder blasting, where we vary the angle of incidence of the powder beam with respect tot the target surface. The oblique impact gives rise to particular side walls effects of micro patterned hole structures. We have applied this microfabrication method for various MEMS applications, like the realization of glass accelerometer beams, biological microsystems for the culture and characterization of living cells and ferrite-based miniaturized transformers for ultra- small power applications.

Official source

https://infoscience.epfl.ch/entities/publication/e3ea973b-c2ae-451e-925b-c06c4fe07cc7

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Martinus Adela Maria Gijs, Abdeljalil Sayah
2000
Conference Papers

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/e3ea973b-c2ae-451e-925b-c06c4fe07cc7

About this result

Related concepts (32)

MEMS

MEMS (Microelectromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2.

Microfabrication

Microfabrication is the process of fabricating miniature structures of micrometre scales and smaller. Historically, the earliest microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device fabrication". In the last two decades microelectromechanical systems (MEMS), microsystems (European usage), micromachines (Japanese terminology) and their subfields, microfluidics/lab-on-a-chip, optical MEMS (also called MOEMS), RF MEMS, PowerMEMS, BioMEMS and their extension into nanoscale (for example NEMS, for nano electro mechanical systems) have re-used, adapted or extended microfabrication methods.

Etching (microfabrication)

Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography. Other situations require a more durable mask, such as silicon nitride.

Related publications (3)

Powder blasting as a three-dimensional microstructuring technology for MEMS applications

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