Semiconductor packageA semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure.
Packaging and labelingPackaging is the science, art and technology of enclosing or protecting products for distribution, storage, sale, and use. Packaging also refers to the process of designing, evaluating, and producing packages. Packaging can be described as a coordinated system of preparing goods for transport, warehousing, logistics, sale, and end use. Packaging contains, protects, preserves, transports, informs, and sells. In many countries it is fully integrated into government, business, institutional, industrial, and personal use.
Hermetic sealA hermetic seal is any type of sealing that makes a given object airtight (preventing the passage of air, oxygen, or other gases). The term originally applied to airtight glass containers, but as technology advanced it applied to a larger category of materials, including rubber and plastics. Hermetic seals are essential to the correct and safe functionality of many electronic and healthcare products. Used technically, it is stated in conjunction with a specific test method and conditions of use.
Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Dual in-line packageIn microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits.
Packaging engineeringPackaging engineering, also package engineering, packaging technology and packaging science, is a broad topic ranging from design conceptualization to product placement. All steps along the manufacturing process, and more, must be taken into account in the design of the package for any given product. Package engineering is an interdisciplinary field integrating science, engineering, technology and management to protect and identify products for distribution, storage, sale, and use.
Package testingPackage testing or packaging testing involves the measurement of a characteristic or property involved with packaging. This includes packaging materials, packaging components, primary packages, shipping containers, and unit loads, as well as the associated processes. Testing measures the effects and interactions of the levels of packaging, the package contents, external forces, and end-use. It can involve controlled laboratory experiments, subjective evaluations by people, or field testing.
Active packagingThe terms active packaging, intelligent packaging, and smart packaging refer to amplified packaging systems used with foods, pharmaceuticals, and several other types of products. They help extend shelf life, monitor freshness, display information on quality, improve safety, and improve convenience. The terms are often related and can overlap. Active packaging usually means having active functions beyond the inert passive containment and protection of the product.
Food packagingFood packaging is a packaging system specifically designed for food and represents one of the most important aspects among the processes involved in the food industry, as it provides protection from chemical, biological and physical alterations. The main goal of food packaging is to provide a practical means of protecting and delivering food goods at a reasonable cost while meeting the needs and expectations of both consumers and industries.
SolderingSoldering (USˈsɒdərɪŋ; UKˈsoʊldərɪŋ) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint. Soldering is commonly used in the electronics industry for the manufacture and repair of printed circuit boards (PCBs) and other electronic components. It is also used in plumbing and metalwork, as well as in the manufacture of jewelry and other decorative items.
Package on a packagePackage on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.
SolderSolder (UKˈsɒldə,_ˈsəʊldə; NA: ˈsɒdər) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Modified atmosphereModified atmosphere packaging (MAP) is the practice of modifying the composition of the internal atmosphere of a package (commonly food packages, drugs, etc.) in order to improve the shelf life. The need for this technology for food arises from the short shelf life of food products such as meat, fish, poultry, and dairy in the presence of oxygen. In food, oxygen is readily available for lipid oxidation reactions. Oxygen also helps maintain high respiration rates of fresh produce, which contribute to shortened shelf life.
Iterative methodIn computational mathematics, an iterative method is a mathematical procedure that uses an initial value to generate a sequence of improving approximate solutions for a class of problems, in which the n-th approximation is derived from the previous ones. A specific implementation with termination criteria for a given iterative method like gradient descent, hill climbing, Newton's method, or quasi-Newton methods like BFGS, is an algorithm of the iterative method.
Induction sealingInduction sealing is the process of bonding thermoplastic materials by induction heating. This involves controlled heating an electrically conducting object (usually aluminum foil) by electromagnetic induction, through heat generated in the object by eddy currents. Induction sealing is used in many types of manufacturing. In packaging it is used for package fabrication such as forming tubes from flexible materials, attaching plastic closures to package forms, etc.
Screen printingScreen printing is a printing technique where a mesh is used to transfer ink (or dye) onto a substrate, except in areas made impermeable to the ink by a blocking stencil. A blade or squeegee is moved across the screen to fill the open mesh apertures with ink, and a reverse stroke then causes the screen to touch the substrate momentarily along a line of contact. This causes the ink to wet the substrate and be pulled out of the mesh apertures as the screen springs back after the blade has passed.
HermeticismHermeticism or Hermetism is a philosophical and religious system based on the purported teachings of Hermes Trismegistus (a Hellenistic conflation of the Greek god Hermes and the Egyptian god Thoth). These teachings are contained in the various writings attributed to Hermes (the Hermetica), which were produced over a period spanning many centuries (300 BCE – 1200 CE) and may be very different in content and scope.
Industrial process controlAn industrial process control or simply process control in continuous production processes is a discipline that uses industrial control systems and control theory to achieve a production level of consistency, economy and safety which could not be achieved purely by human manual control. It is implemented widely in industries such as automotive, mining, dredging, oil refining, pulp and paper manufacturing, chemical processing and power generating plants.
Impedance analogyThe impedance analogy is a method of representing a mechanical system by an analogous electrical system. The advantage of doing this is that there is a large body of theory and analysis techniques concerning complex electrical systems, especially in the field of filters. By converting to an electrical representation, these tools in the electrical domain can be directly applied to a mechanical system without modification.
Mechanical–electrical analogiesMechanical–electrical analogies are the representation of mechanical systems as electrical networks. At first, such analogies were used in reverse to help explain electrical phenomena in familiar mechanical terms. James Clerk Maxwell introduced analogies of this sort in the 19th century. However, as electrical network analysis matured it was found that certain mechanical problems could more easily be solved through an electrical analogy.
