Publication

Structure of platinum and tin films formed by laser-induced chemical vapor deposition

Hubert van den Bergh
1984
Book Chapters

Abstract

Similarities and differences in the structure and shape of the metallic deposit were studied for photolytic and pyrolytic laser-induced chem. vapor deposition of Sn and Pt. The photolytically deposited thin metallic films appear to be more homogeneous and tend to be amorphous. The pyrolytically deposited films are polycryst. and are more irregular, in particular in the case of Sn where the hot drop-like particles coalesce on the surface yielding a microscopic deposit of quite varied sizes and shapes.

Official source

https://infoscience.epfl.ch/entities/publication/e05187ab-5a70-490d-9e61-23e3264df338

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Hubert van den Bergh
1984
Book Chapters

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/e05187ab-5a70-490d-9e61-23e3264df338

About this result

Related concepts (29)

Plasma-enhanced chemical vapor deposition

Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) (alternating current (AC)) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

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Structure of platinum and tin films formed by laser-induced chemical vapor deposition

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