Publication

Evaluation of Thin Film Indium Bonding at Wafer Level

Nico de Rooij
2011
Conference Papers

Abstract

needed. By an optimized patterning of the evaporated indium film and the lid, surface hermetic bonding on wafer level is reached without exceeding 140 °C in any step of the procedure. Different designs of the indium metallization and lid were tested to improve bond strength while keeping the same bonding parameters. By depositing an adhesion layer of CrAu on the lid, the bond strength can be increased by 30 % compared to the one of indium to glass bonding. Another way to increase bond strength by 40 % is to profile one bonding surface in such a way that the indium oxide breaks at multiple places within the deposited area. Hermeticity is proven for all different designs.

Official source

https://infoscience.epfl.ch/entities/publication/ced7668c-b8e4-4e55-bfde-cb9ec631ca7c

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Nico de Rooij
2011
Conference Papers

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/ced7668c-b8e4-4e55-bfde-cb9ec631ca7c

About this result

Related concepts (29)

Chemical bond

A chemical bond is a lasting attraction between atoms or ions that enables the formation of molecules, crystals, and other structures. The bond may result from the electrostatic force between oppositely charged ions as in ionic bonds, or through the sharing of electrons as in covalent bonds. The strength of chemical bonds varies considerably; there are "strong bonds" or "primary bonds" such as covalent, ionic and metallic bonds, and "weak bonds" or "secondary bonds" such as dipole–dipole interactions, the London dispersion force, and hydrogen bonding.

Indium

Indium is a chemical element with the symbol In and atomic number 49. Indium is the softest metal that is not an alkali metal. It is a silvery-white metal that resembles tin in appearance. It is a post-transition metal that makes up 0.21 parts per million of the Earth's crust. Indium has a melting point higher than sodium and gallium, but lower than lithium and tin. Chemically, indium is similar to gallium and thallium, and it is largely intermediate between the two in terms of its properties.

Hydrogen bond

In chemistry, a hydrogen bond (or H-bond) is a primarily electrostatic force of attraction between a hydrogen (H) atom which is covalently bound to a more electronegative "donor" atom or group (Dn), and another electronegative atom bearing a lone pair of electrons—the hydrogen bond acceptor (Ac). Such an interacting system is generally denoted , where the solid line denotes a polar covalent bond, and the dotted or dashed line indicates the hydrogen bond.

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Evaluation of Thin Film Indium Bonding at Wafer Level

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