Exploiting Fast Carry-Chains Of Fpgas For Designing Compressor Trees

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Green Cryptography and Other Optimisations

Andrea Felice Caforio

The spectral decomposition of cryptography into its life-giving components yields an interlaced network of tangential and orthogonal disciplines that are nonetheless invariably grounded by the same denominator: their implementation on commodity computing p ...

EPFL2023

Integrated Electronics for Deep Implants to Remotely Monitor Hemodynamics

Mustafa Besirli

The integration of technology in the medical field has greatly improved accuracy in diagnoses, thus leading to more effective treatments. Wearable and implantable medical devices offer great potential for remote patient monitoring, particularly for heart f ...

EPFL2023

Temperature Impact on Remote Power Side-Channel Attacks on Shared FPGAs

Mathias Josef Payer, Mirjana Stojilovic, Ognjen Glamocanin

To answer the growing demand for hardware acceleration, Amazon, Microsoft, and many other major cloud service providers have included field-programmable gate arrays (FPGAs) in their datacenters. However, researchers have shown that cloud FPGAs, when shared ...

IEEE2023

Building Chips Faster: Hardware-Compiler Co-Design for Accelerated RTL Simulation

Sahand Kashani

The demise of Moore's Law and Dennard scaling has resulted in diminishing performance gains for general-purpose processors, and so has prompted a surge in academic and commercial interest for hardware accelerators. Specialized hardware has already redefine ...

EPFL2023

Energy-Efficient Electronic Functions Based on the Co-integration of 2D and Ferroelectric Materials

Sadegh Kamaei Bahmaei

The digital revolution has significantly transformed our world over the past decades, driven by the scaling of transistor dimensions and the exponential increase in computation power. However, as the CMOS scaling era approaches its end, the semiconductor i ...

EPFL2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

Programmable frequency-bin quantum states in a nano-engineered silicon device

Matteo Galli, Marco Clementi

Frequency-bin qubits get the best of time-bin and dual-rail encodings, but require external modulators and pulse shapers to build arbitrary states. Here, instead, the authors work directly on-chip by controlling the interference of biphoton amplitudes gene ...

Nature Portfolio2023

Acceleration of Control Intensive Applications on Coarse-Grained Reconfigurable Arrays for Embedded Systems

David Atienza Alonso, Miguel Peon Quiros, Benoît Walter Denkinger

Embedded systems confront two opposite goals: low-power operation and high performance. The current trend to reach these goals is toward heterogeneous platforms, including multi-core architectures with heterogeneous cores and hardware accelerators. The lat ...

2023

Improving Standard-Cell Design Flow using Factored Form Optimization

Giovanni De Micheli, Alessandro Tempia Calvino

Factored form is a powerful multi-level representation of a Boolean function that readily translates into an implementation of the function in CMOS technology. In particular, the number of literals in a factored form correlates strongly with the number of ...

IEEE2023

DFAulted: Analyzing and Exploiting CPU Software Faults Caused by FPGA-Driven Undervolting Attacks

Mirjana Stojilovic, Dina Gamaleldin Ahmed Shawky Mahmoud

Field-programmable gate arrays (FPGAs) combine hardware reconfigurability with a high degree of parallelism. Consequently, FPGAs offer performance gains and power savings for many applications. A recent trend has been to leverage the hardware versatility o ...

2022

An All-Digital 1 Mbps, 57 pJ/bit Bluetooth Low Energy (BLE) Backscatter ASIC in 65 nm CMOS

James Daniel Rosenthal

We present an all-digital application specific integrated circuit (ASIC) that implements Bluetooth Low Energy (BLE)-compatible backscatter communication. The ASIC was fabricated in a 65 nm CMOS process and occupies an active area of 0.12 mm(2) while consum ...

IEEE2022

A Real-Time Multi-Camera Depth Estimation ASIC with Custom On-Chip Embedded DRAM

Jonathan Emmanuel D Narinx

The capability to process high-resolution videos in real-time is becoming more important in a wide variety of applications such as autonomous vehicles, virtual reality or intelligent surveillance systems. The high-accuracy and complex video processing algo ...

EPFL2019