Publication

Deposition kinetics of platinum small ohmic contacts and Schottky diodes

Hubert van den Bergh
1991
Journal Articles

Abstract

A 351-363 nm wavelength argon laser is used to induce pyrolytic laser chem. vapor deposition of platinum, using platinum bishexafluoroacetylacetonate as a precursor. The deposit thicknesses and diams. are presented according to exposure time, precursor pressure, and laser spot diam. Calcn. of the temp. induced by the laser radiation exposure by using a method developed allows one to study the kinetics of the deposition process which takes place either under a regimen controlled by the diffusion of the reactants or under a regimen controlled by the reaction kinetics, depending on the laser power d. used. The process presents an apparent activation energy of about 6 kcal/mol. The deposits obtained present high purity and good elec. and morphol. properties.

Official source

https://infoscience.epfl.ch/entities/publication/ace77c53-648a-4969-9052-ff13ac4838be

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Hubert van den Bergh
1991
Journal Articles

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/ace77c53-648a-4969-9052-ff13ac4838be

About this result

Related concepts (32)

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Vacuum deposition

Vacuum deposition , also known as vacuum coating or thin-film deposition, is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e., vacuum). The deposited layers can range from a thickness of one atom up to millimeters, forming freestanding structures. Multiple layers of different materials can be used, for example to form optical coatings.

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Deposition kinetics of platinum small ohmic contacts and Schottky diodes

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