Publication

Growth, Characterization and Adhesion of Thick Deposited Tungsten Layers Under Transient Loading in Magnum-PSI

2026

Abstract

The recent decision by ITER to move from a Be to a W first wall has significant implications for material transport and deposition, and can be expected to lead to increased W layer growth rate in deposition regions, which may flake leading to plasma disruption. In this work a novel sputtering set-up was implemented in the Magnum-PSI linear plasma device to create W layers under ITER relevant conditions. A W plate was inserted into the plasma edge and biased to cause sputtering of W in an Ar plasma. This sputtered W was entrained by the plasma and deposited on an array of mixed W and Mo targets at

Official source

https://infoscience.epfl.ch/entities/publication/a97df56e-a90d-40cb-adc9-4555e3c45cf4

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2026

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/a97df56e-a90d-40cb-adc9-4555e3c45cf4

About this result

Related concepts (32)

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Plasma-enhanced chemical vapor deposition

Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) (alternating current (AC)) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.

Evaporation (deposition)

Evaporation is a common method of thin-film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state. Evaporation is used in microfabrication, and to make macro-scale products such as metallized plastic film. Evaporation involves two basic processes: a hot source material evaporates and condenses on the substrate. It resembles the familiar process by which liquid water appears on the lid of a boiling pot.

Related publications (1)

Growth, Characterization and Adhesion of Thick Deposited Tungsten Layers Under Transient Loading in Magnum-PSI

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Dependence of Intrinsic Stress in Hydrogenated Amorphous-Silicon on Excitation-Frequency in a Plasma-Enhanced Chemical Vapor-Deposition Process