Vacuum depositionVacuum deposition , also known as vacuum coating or thin-film deposition, is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e., vacuum). The deposited layers can range from a thickness of one atom up to millimeters, forming freestanding structures. Multiple layers of different materials can be used, for example to form optical coatings.
Heat sinkA heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules.
Heat transferHeat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy (heat) between physical systems. Heat transfer is classified into various mechanisms, such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes. Engineers also consider the transfer of mass of differing chemical species (mass transfer in the form of advection), either cold or hot, to achieve heat transfer.
ElectromagnetismIn physics, electromagnetism is an interaction that occurs between particles with electric charge via electromagnetic fields. The electromagnetic force is one of the four fundamental forces of nature. It is the dominant force in the interactions of atoms and molecules. Electromagnetism can be thought of as a combination of electrostatics and magnetism, two distinct but closely intertwined phenomena.
Plane mirrorA plane mirror is a mirror with a flat (planar) reflective surface. For light rays striking a plane mirror, the angle of reflection equals the angle of incidence. The angle of the incidence is the angle between the incident ray and the surface normal (an imaginary line perpendicular to the surface). Therefore, the angle of reflection is the angle between the reflected ray and the normal and a collimated beam of light does not spread out after reflection from a plane mirror, except for diffraction effects.
Evaporation (deposition)Evaporation is a common method of thin-film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state. Evaporation is used in microfabrication, and to make macro-scale products such as metallized plastic film. Evaporation involves two basic processes: a hot source material evaporates and condenses on the substrate. It resembles the familiar process by which liquid water appears on the lid of a boiling pot.
Chemical vapor depositionChemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.
Plasma-enhanced chemical vapor depositionPlasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) (alternating current (AC)) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.
Planar transmission linePlanar transmission lines are transmission lines with conductors, or in some cases dielectric (insulating) strips, that are flat, ribbon-shaped lines. They are used to interconnect components on printed circuits and integrated circuits working at microwave frequencies because the planar type fits in well with the manufacturing methods for these components. Transmission lines are more than simply interconnections.
Free-space path lossIn telecommunication, the free-space path loss (FSPL) (also known as free-space loss, FSL) is the attenuation of radio energy between the feedpoints of two antennas that results from the combination of the receiving antenna's capture area plus the obstacle-free, line-of-sight (LoS) path through free space (usually air). The "Standard Definitions of Terms for Antennas", IEEE Std 145-1993, defines free-space loss as "The loss between two isotropic radiators in free space, expressed as a power ratio.
Reflecting telescopeA reflecting telescope (also called a reflector) is a telescope that uses a single or a combination of curved mirrors that reflect light and form an . The reflecting telescope was invented in the 17th century by Isaac Newton as an alternative to the refracting telescope which, at that time, was a design that suffered from severe chromatic aberration. Although reflecting telescopes produce other types of optical aberrations, it is a design that allows for very large diameter objectives.
Electromagnetic shieldingIn electrical engineering, electromagnetic shielding is the practice of reducing or blocking the electromagnetic field (EMF) in a space with barriers made of conductive or magnetic materials. It is typically applied to enclosures, for isolating electrical devices from their surroundings, and to cables to isolate wires from the environment through which the cable runs (). Electromagnetic shielding that blocks radio frequency (RF) electromagnetic radiation is also known as RF shielding.
