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Performance improvement of chip-level CMOS-integrated ReRAM cells through material optimization

Yusuf Leblebici, Thomas La Grange, Tugba Demirci, Elmira Shahrabi

The integration of the resistive random access memory (ReRAM) with CMOS logic circuitry provides a solution to scaling limitations, and offers promising candidates for use in next generation computing applications. It is challenging to realize a reliable, ...

ELSEVIER SCIENCE BV2019

3D printed microwave cavity for atomic clock applications: proof of concept

Anja Skrivervik, Emile Jacques de Rijk

The authors present the realisation and characterisation of an additively manufactured (AM) microwave resonator cavity for double-resonance (DR) vapour-cell atomic clocks. The design of the compact microwave cavity is based on the loop-gap resonator approa ...

2018

Subthreshold Mismatch in Nanometer CMOS at Cryogenic Temperatures

Edoardo Charbon

Cryogenic device models are essential for the reliable design of the cryo-CMOS interface that enables large-scale quantum computers. In this paper, mismatch characterization and modeling of a 40-nm bulk CMOS process over the 4.2-300 K temperature range is ...

IEEE2019

An Eight lanes 7Gb/s/pin Source Synchronous Single-Ended RX with Equalization and Far-End Crosstalk Cancellation for Backplane Channels

Yusuf Leblebici, Volkan Cevher, Alessandro Cevrero, Thomas Toifl, Lukas Kull, Cosimo Aprile

This paper presents a versatile crosstalk cancellation scheme for single-ended multi-lane backplane links. System-level investigations show that a scheme, which combines analog filters and decision-feedback crosstalk compensation on the receiver (RX) side ...

2018

Characterization of a Piezoelectric AlN Beam Array in Air and Fluid for an Artificial Basilar Membrane

Jongmoon Jang

In this study, we present a piezoelectric artificial basilar membrane (ABM) composed of a 10-channel aluminum nitride beam array. Each beam varies in length from 1306 to 3194 mu m for mimicking the frequency selectivity of the cochlea. To characterize the ...

KOREAN INST METALS MATERIALS2018

Fabrication and Characterization of Freestanding Single Crystal Diamond and Silicon Microresonators

Teodoro Graziosi

Microresonators are fundamental building blocks of any photonic integrated circuit, as they can be used as filters, modulators, sensors, and to enhance light emission. If these resonators are suspended and are free to oscillate, we can exploit the interact ...

EPFL2019

Vibration Mode of MEMS Ultrasonic Sensors on Buckled Diaphragms with Piezoelectric Resonance Frequency Modification

Paul Muralt

Vibration mode and resonance frequency of piezoelectric MEMS ultrasonic sensors was investigated on buckled diaphragm structures. The buckling of the diaphragms was introduced intrinsically through residual stress control of the piezoelectric film, and ext ...

IEEE2019

Monolithic technology for silicon nanowires in high-topography architectures

Yusuf Leblebici

Integration of silicon nanowires (Si NWs) in three-dimensional (3D) devices including integrated circuits (ICs) and microelectromechanical systems (MEMS) leads to enhanced functionality and performance in diverse applications. The immediate challenge to th ...

Elsevier2017

5 GHz laterally-excited bulk-wave resonators (XBARs) based on thin platelets of lithium niobate

Luis Guillermo Villanueva Torrijo, Soumya Yandrapalli

In a free-standing 400-nm-thick platelet of crystalline ZY-LiNbO3, narrow electrodes (500 nm) placed periodically with a pitch of a few microns can eXcite standing shear-wave bulk acoustic resonances (XBARs), by utilising lateral electric fields oriented p ...

2019

Tuning the resonance frequencies and mode shapes in a large range multi-degree of freedom micromirror

Matthias Imboden

The ability to actively shift the primary resonance of a 2D scanning micromirror allows the user to set the scanning direction, set the scanning frequency, and lift otherwise degenerate modes in a symmetrically designed system. In most cases, resonant scan ...

Optical Soc Amer2017

Transient current technique for charged traps detection in silicon bonded interfaces

Jean-Michel Sallese, Alessandro Mapelli, Didier Bouvet

Wafer bonding is an established technology for the manufacturing of silicon-on-insulator (SOI) substrates, microelectromechanical systems (MEMS) and microfluidic devices. Low temperature direct bonding techniques can be of particular interest for the fabri ...

2019

Three-Dimensional Nano-Acoustic Bragg Reflectors for CMOS Embedded NEMS

Luis Guillermo Villanueva Torrijo, Soumya Yandrapalli, David Ruffieux

Integration of CMOS electronic circuits and electromechanical resonators has been pursued for a long time by many different research groups and even foundries. This would improve the overall performance of electromechanical oscillators and sensors. However ...

Institute of Electrical and Electronics Engineers2017

A Deep Etching Mechanism for Trench-Bridging Silicon Nanowires

Yusuf Leblebici, Zuhal Tasdemir

Introducing a single silicon nanowire with a known orientation and dimensions to a specific layout location constitutes a major challenge. The challenge becomes even more formidable, if one chooses to realize the task in a monolithic fashion with an extrem ...

Institute of Physics2016