Publication

Design Space Exploration for Optimal Silicon-Efficient Server Chiplets

2026

Abstract

Datacenter growth is driving unprecedented demand for both electricity and physical infrastructure. Today's servers typically rely on wide out-of-order (OoO) cores running at high nominal frequencies to meet SLOs, but rising power, silicon, memory, and cooling constraints call for rethinking this design point. We present a methodology for designing power-density-optimized CPU chiplets for server workloads. Our results show that optimal operating frequency can be up to 50% lower for air-cooled systems, and chiplets may favor in-order (InO) cores even for SLO-sensitive services, contrary to conventional trends. Overall, power-density-optimized chiplets improve performance by 1.7×-6.1× over conventional out-of-order baseline chiplets.

Official source

https://infoscience.epfl.ch/entities/publication/9c28942c-3e42-478d-9414-fe35e21219f1

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2026

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/9c28942c-3e42-478d-9414-fe35e21219f1

About this result

Related concepts (32)

Heating, ventilation, and air conditioning

Heating, ventilation, and air conditioning (HVAC) is the use of various technologies to control the temperature, humidity, and purity of the air in an enclosed space. Its goal is to provide thermal comfort and acceptable indoor air quality. HVAC system design is a subdiscipline of mechanical engineering, based on the principles of thermodynamics, fluid mechanics, and heat transfer. "Refrigeration" is sometimes added to the field's abbreviation as HVAC&R or HVACR, or "ventilation" is dropped, as in HACR (as in the designation of HACR-rated circuit breakers).

System on a chip

A system on a chip or system-on-chip (SoC ,ˈɛsoʊsiː; pl. SoCs ,ˈɛsoʊsiːz) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip.

Air cooling

Air cooling is a method of dissipating heat. It works by expanding the surface area or increasing the flow of air over the object to be cooled, or both. An example of the former is to add cooling fins to the surface of the object, either by making them integral or by attaching them tightly to the object's surface (to ensure efficient heat transfer). In the case of the latter, it is done by using a fan blowing air into or onto the object one wants to cool.

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