Heating, ventilation, and air conditioningHeating, ventilation, and air conditioning (HVAC) is the use of various technologies to control the temperature, humidity, and purity of the air in an enclosed space. Its goal is to provide thermal comfort and acceptable indoor air quality. HVAC system design is a subdiscipline of mechanical engineering, based on the principles of thermodynamics, fluid mechanics, and heat transfer. "Refrigeration" is sometimes added to the field's abbreviation as HVAC&R or HVACR, or "ventilation" is dropped, as in HACR (as in the designation of HACR-rated circuit breakers).
System on a chipA system on a chip or system-on-chip (SoC ,ˈɛsoʊsiː; pl. SoCs ,ˈɛsoʊsiːz) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip.
Air coolingAir cooling is a method of dissipating heat. It works by expanding the surface area or increasing the flow of air over the object to be cooled, or both. An example of the former is to add cooling fins to the surface of the object, either by making them integral or by attaching them tightly to the object's surface (to ensure efficient heat transfer). In the case of the latter, it is done by using a fan blowing air into or onto the object one wants to cool.
Evaporative coolerAn evaporative cooler (also known as evaporative air conditioner, swamp cooler, swamp box, desert cooler and wet air cooler) is a device that cools air through the evaporation of water. Evaporative cooling differs from other air conditioning systems, which use vapor-compression or absorption refrigeration cycles. Evaporative cooling exploits the fact that water will absorb a relatively large amount of heat in order to evaporate (that is, it has a large enthalpy of vaporization).
Cooling towerA cooling tower is a device that rejects waste heat to the atmosphere through the cooling of a coolant stream, usually a water stream, to a lower temperature. Cooling towers may either use the evaporation of water to remove process heat and cool the working fluid to near the wet-bulb air temperature or, in the case of dry cooling towers, rely solely on air to cool the working fluid to near the dry-bulb air temperature using radiators.
Intel CoreIntel Core is a line of streamlined midrange consumer, workstation and enthusiast computer central processing units (CPUs) marketed by Intel Corporation. These processors displaced the existing mid- to high-end Pentium processors at the time of their introduction, moving the Pentium to the entry level. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets. The lineup of Core processors includes the Intel Core i3, Intel Core i5, Intel Core i7, and Intel Core i9, along with the X-series of Intel Core CPUs.
Deep water source coolingDeep water source cooling (DWSC) or deep water air cooling is a form of air cooling for process and comfort space cooling which uses a large body of naturally cold water as a heat sink. It uses water at 4 to 10 degrees Celsius drawn from deep areas within lakes, oceans, aquifers or rivers, which is pumped through the one side of a heat exchanger. On the other side of the heat exchanger, cooled water is produced. Water is most dense at at standard atmospheric pressure. Thus as water cools below 3.
Air conditioningAir conditioning, often abbreviated as A/C (US), AC (US), or air con (UK), is the process of removing heat from an enclosed space to achieve a more comfortable interior environment (sometimes referred to as "comfort cooling") and in some cases also strictly controlling the humidity of internal air. Air conditioning can be achieved using a mechanical air conditioner or alternatively a variety of other methods, including passive cooling or ventilative cooling.
Computer coolingComputer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, and hard disk drives. Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling.
Water coolingWater cooling is a method of heat removal from components and industrial equipment. Evaporative cooling using water is often more efficient than air cooling. Water is inexpensive and non-toxic; however, it can contain impurities and cause corrosion. Water cooling is commonly used for cooling automobile internal combustion engines and power stations. Water coolers utilising convective heat transfer are used inside high-end personal computers to lower the temperature of CPUs and other components.
Radiant heating and coolingRadiant heating and cooling is a category of HVAC technologies that exchange heat by both convection and radiation with the environments they are designed to heat or cool. There are many subcategories of radiant heating and cooling, including: "radiant ceiling panels", "embedded surface systems", "thermally active building systems", and infrared heaters.
Out-of-order executionIn computer engineering, out-of-order execution (or more formally dynamic execution) is a paradigm used in most high-performance central processing units to make use of instruction cycles that would otherwise be wasted. In this paradigm, a processor executes instructions in an order governed by the availability of input data and execution units, rather than by their original order in a program. In doing so, the processor can avoid being idle while waiting for the preceding instruction to complete and can, in the meantime, process the next instructions that are able to run immediately and independently.
Thermal design powerThe thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called scenario design power (SDP) for some Ivy Bridge Y-series processors.
Dynamic frequency scalingDynamic frequency scaling (also known as CPU throttling) is a power management technique in computer architecture whereby the frequency of a microprocessor can be automatically adjusted "on the fly" depending on the actual needs, to conserve power and reduce the amount of heat generated by the chip. Dynamic frequency scaling helps preserve battery on mobile devices and decrease cooling cost and noise on quiet computing settings, or can be useful as a security measure for overheated systems (e.g.
Transistor countThe transistor count is the number of transistors in an electronic device (typically on a single substrate or "chip"). It is the most common measure of integrated circuit complexity (although the majority of transistors in modern microprocessors are contained in the cache memories, which consist mostly of the same memory cell circuits replicated many times). The rate at which MOS transistor counts have increased generally follows Moore's law, which observed that the transistor count doubles approximately every two years.
IntelIntel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years.
Thermoelectric coolingThermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current. Such an instrument is also called a Peltier device, Peltier heat pump, solid state refrigerator, or thermoelectric cooler (TEC) and occasionally a thermoelectric battery.
Zen (microarchitecture)Zen is the codename for a family of computer processor microarchitectures from AMD, first launched in February 2017 with the first generation of its Ryzen CPUs. It is used in Ryzen (desktop and mobile), Ryzen Threadripper (workstation/high end desktop), and Epyc (server). Zen (first generation) The first generation Zen was launched with the Ryzen 1000 series of CPUs (codenamed Summit Ridge) in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016.
InfrastructureInfrastructure is the set of facilities and systems that serve a country, city, or other area, and encompasses the services and facilities necessary for its economy, households and firms to function. Infrastructure is composed of public and private physical structures such as roads, railways, bridges, tunnels, water supply, sewers, electrical grids, and telecommunications (including Internet connectivity and broadband access).
Intel Core (microarchitecture)The Intel Core microarchitecture (provisionally referred to as Next Generation Micro-architecture, and developed as Merom) is a multi-core processor microarchitecture launched by Intel in mid-2006. It is a major evolution over the Yonah, the previous iteration of the P6 microarchitecture series which started in 1995 with Pentium Pro. It also replaced the NetBurst microarchitecture, which suffered from high power consumption and heat intensity due to an inefficient pipeline designed for high clock rate.
