Publication

Convex-Based Thermal Management for 3D MPSoCs Using DVFS and Variable-Flow Liquid Cooling

2011
Conference Papers

Abstract

In this work, we propose a novel online thermal management approach based on model predictive control for 3D multi-processors system on chip (MPSoCs) using microfluidic cooling. The controller uses dynamic voltage and frequency scaling (DVFS) for the computational cores and adjusts the liquid flow rate to meet the desired performance requirements and to minimize the overall MPSoC energy consumption (MPSoC power consumption+cooling power consumption). Our experimental results illustrate that our policy satisfies performance requirements and maintains the temperature below the specified threshold, while reducing cooling energy by up to 50% compared with traditional state-of-the-art liquid cooling techniques. The proposed policy also keeps the thermal profile up to 18°C lower compared with state of the art 3D thermal management using variable-flow liquid cooling.

Official source

https://infoscience.epfl.ch/entities/publication/96dbd5e9-fad9-42e7-a37c-87266e36515a

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2011
Conference Papers

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/96dbd5e9-fad9-42e7-a37c-87266e36515a

About this result

Related concepts (32)

Cooling tower

A cooling tower is a device that rejects waste heat to the atmosphere through the cooling of a coolant stream, usually a water stream, to a lower temperature. Cooling towers may either use the evaporation of water to remove process heat and cool the working fluid to near the wet-bulb air temperature or, in the case of dry cooling towers, rely solely on air to cool the working fluid to near the dry-bulb air temperature using radiators.

Thermal management (electronics)

All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.

System on a chip

A system on a chip or system-on-chip (SoC ,ˈɛsoʊsiː; pl. SoCs ,ˈɛsoʊsiːz) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip.

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